SemiQ Inc has expanded its QSiC™ Dual3 family of half-bridge silicon carbide MOSFET modules with new 1700 V options and ...

TDK Corporation has expanded its D1SE series DIN-rail mount power supplies with 12 V, 48 V and 72 V output models to support ...

There's a critical symbiosis between artificial intelligence (AI) and solid-state transformers (SSTs), especially in ...

RS is offering Banner Engineering’s portfolio of non-contact sensors for industrial automation and Industry 4.0 applications, ...

Tektronix® has introduced wideband shunts for IsoVu™ isolated current probes and the THDP0400 high voltage differential probe ...

Efinix® Inc. has introduced the Titanium Edge™ family of FPGAs for edge AI applications, with devices ranging from 39,000 to ...

Nick Perosino, New Product Development Manager at Central Semiconductor (an AEM Company), recently presented a webinar on ...

In Part 1 of this Q&A, Nick Perosino, New Product Development Manager at Central Semiconductor (an AEM Company), made the case for bare die as a solution to mechanical and electrical design ...

Designing the future of WBG Moving from silicon to GaN or SiC feels like a whole new ballgame, doesn’t it? It isn’t just ...

TDK Corporation has introduced the B25696H series of MKP DC high-frequency film capacitors for SiC-based DC-link designs, ...

In Part 2 of this Q&A series, based on the EE Training Day, Ben Ellis, Technical Applications Engineer at Pico Technology, ...

The 2.92 mm connectors from Amphenol RF are vertical PCB jacks for stripline and microstrip designs that use a solderless ...