Q1, a battery monitor for EV and energy storage systems that integrates an electrochemical impedance spectroscopy engine for ...
Qorvo® has introduced the QPF5012 X-band transmit/receive front-end module for phased array radar and multifunction sensor ...
Efficient Power Conversion has introduced the EPC91132, a 23 mm three-phase BLDC motor drive inverter reference design for ...
SemiQ Inc has expanded its QSiC™ Dual3 family of half-bridge silicon carbide MOSFET modules with new 1700 V options and ...
There's a critical symbiosis between artificial intelligence (AI) and solid-state transformers (SSTs), especially in ...
TDK Corporation has expanded its D1SE series DIN-rail mount power supplies with 12 V, 48 V and 72 V output models to support ...
RS is offering Banner Engineering’s portfolio of non-contact sensors for industrial automation and Industry 4.0 applications, ...
Tektronix® has introduced wideband shunts for IsoVu™ isolated current probes and the THDP0400 high voltage differential probe ...
Efinix® Inc. has introduced the Titanium Edge™ family of FPGAs for edge AI applications, with devices ranging from 39,000 to ...
Nick Perosino, New Product Development Manager at Central Semiconductor (an AEM Company), recently presented a webinar on ...
Designing the future of WBG Moving from silicon to GaN or SiC feels like a whole new ballgame, doesn’t it? It isn’t just ...
In Part 1 of this Q&A, Nick Perosino, New Product Development Manager at Central Semiconductor (an AEM Company), made the case for bare die as a solution to mechanical and electrical design ...
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