As power systems handle larger loads, a new current measurement approach aims to support testing, monitoring, and performance ...

New automotive-grade load switch combines ultra-low on-resistance, integrated protection, and compact packaging to improve ...

From advanced packaging and RISC-V to AI-driven manufacturing and startup-led innovation, Sharat Kaul of the International ...

New-generation signal analysers expand bandwidth, frequency coverage, and measurement speed to help engineers accelerate wireless, radar, and RF validation workflows.

A new automotive radar SoC integrates sensing and perception processing on a single chip, helping automakers reduce system ...

New industrial-grade 650V GaN devices introduce multiple on-resistance options and package formats, helping engineers ...

A battery monitoring chip can now look inside battery cells, spotting problems early while helping improve safety, battery ...

A new plug-in hybrid system promises electric-first driving, ultra-long range, low fuel consumption, and reduced dependence ...

The successful candidate will work on a range of exciting new products such as discrete low voltage GaN, GaN power stages, ...

A newly introduced surface-mount package for silicon carbide power devices combines high heat dissipation, 1200V-class ...

Electronic parts can now be fed from trays automatically, helping reduce manual work, speed up production, and handle up to ...

MIT researchers have developed a diamond-based thermal management approach that improves heat dissipation in high-power ...