Samsung expanded 2nm and 4nm product lines, announced chiplet co-packaged optics by 2027 had an 80% increase in its AI foundry business over the last year.

Samsung Electronics said its contract manufacturing business plans to offer a one-stop shop for clients to get their AI chips made faster, integrating its global No. 1 memory chip, foundry, and chip packaging services,

Samsung Electronics Co. unveiled a number of forthcoming advancements to its technology aimed at luring makers of AI chips to its manufacturing business.

Promising to lead the AI semiconductor revolution, Samsung Electronics emphasized its exclusive “one-stop” service for foundry, memory, and advanced packaging at the Foundry Forum 2024 on June 12. In San Jose,

Samsung Electronics has announced a major advancement in its contract manufacturing business, aimed at expediting the production of AI chips. The South Korean tech giant revealed plans to offer an integrated “one-stop shop” solution,

Samsung‘s semiconductor foundry is on track to mass-produce 2nm chips in 2025 and 1.4nm chips in 2027. At the ongoing Samsung Foundry Forum (SFF) event in San Jose, California, the company revealed that its process technology development is progressing smoothly as planned.

Samsung Electronics emphasized its capacity for turnkey, or one-stop, AI chip production at the Samsung Foundry Forum, aiming to close its gap with TSMC and differentiate itself from competitors like Intel.