AI scalability will require full-stack co-optimization, not just bigger data centers. AI workloads require a 10X compute ...

We nod at it, we put it on slides, and we move on. But the goalposts keep moving. Things that used to live comfortably at the ...

ChipAgents has introduced Renoir, an agentic large language model (LLM) whose name means “renew.” In early chip design ...

At the recent Data Center World 2026 in Washington, D.C., one message came through louder than ever: AI infrastructure is ...

Agentic AI has the potential to make engineers more productive, speed time to market, and automate some of the drudge work. The big challenge for design and verification engineers is where and whether ...

ULVAC’s Brian J. Coppa, Micron’s Amit Srivastava, SEMI’s Mark da Silva, and SEMI’s Anshu Bahadur propose a comprehensive semiconductor industry roadmap covering carbon emissions, water, and hazardous ...

More steps in the design flow are shifting left, which makes a complicated design process even more complex. This includes early software prototyping, workload mapping, verification, multi-physics ...

In Part 1, we looked at the innovations underpinning the Cerebras WSE-3 and why its most significant breakthrough is the elimination of data movement overhead at the architectural ...

As System-on-Chip (SoC) designs become increasingly complex, engineering teams face growing challenges coordinating hardware and software development across multiple domains. Today’s projects require ...

As semiconductor technology advances to sub-5 nm nodes, curvilinear mask features are essential for pattern fidelity but challenge traditional OPC methods. Siemens introduces an advanced vector-based ...

As chiplet-based architectures gain traction across high-performance and cost-sensitive semiconductor applications, selecting the appropriate die-to-die interconnect standard has become a critical ...