GAA to CFET; prioritize communication, not compute; verification headwinds; scale-up networks; local AI; high-volume CPO.

As AI, chiplets, software-defined systems, and new regulations expand the attack surface, visibility, accountability, and ...

The rapid build-out of AI on the edge marks a fundamental shift in where intelligence is located, how much is included in ...

Chips are getting bigger, more modular, and much more capable as new innovations mix with existing processes and ...

In handwritten digit recognition, it achieved a 90.4% recognition accuracy while reducing input data by 75% “The core of this ...

Memory makers typically design all the layers of an HBM stack, but for a custom base die, who will design it? Who will ...

At the heart of CFETs are defect-free epitaxy, ALD dielectrics, workfunction-optimized metals, and perhaps layer transfer.

Semiconductor R&D depends on access to high-quality data, realistic process assumptions, and practical learning from silicon.

To increase interconnect density to support the bandwidth requirements of AI workloads, manufacturers are turning to 2.5D and 3D packaging architectures. While 2.5D interposers, as passive components, ...

Reducing energy consumption is key to both lowering inference cost and enabling emerging physical AI applications.

Cadence’s Ravi Vora explains how the AMBA AXI5 Memory Tagging Extension can detect memory misuse with minimal runtime overhead by associating a small allocation tag with each memory granule and ...