You probably know this bottleneck too well: full transistor-level or physical simulations—whether analog circuit, electromagnetic, or thermal—can take weeks or even months. For complex designs, ...

A circuit can look perfect on day one and still drift out of specification after months or years of electrical and thermal stress. That is the reliability problem in a nutshell: the design does not ...

Change is coming, but how quickly depends on the availability of data and when chipmakers are confident enough to let AI take over.

Joo-Ann Beh is a solution manager at Keysight Technologies, focusing on health care solutions within the General Electronics Measurement Solutions group. She began her ...

Photonics is forcing EDA to verify not just chips, but the physics of light inside full electro-optical systems.

Scaling NoCs across chiplets requires earlier validation of coherency, congestion, thermal effects, and fault behavior.

As systems become more advanced, engineering intelligence cannot remain fragmented across isolated AI models that only ...

AI-driven compute demands have led to several distinct supply chain bottlenecks for data centers. Legacy power management ...

Securing physical AI; agents need feedback; 3D-IC security; chiplet interoperability; RF digital twins.

Near-memory HBM for LLM inference; processing-in-memory for 3D DRAM; SDV hardware abstraction; 3nm GAAFET SRAM self-heating ...

Fine-pitch hybrid bonding extends a proven production technology into a manufacturing regime with much smaller margins for particles, surface variation, distortion ...

Hybrid bonding is essential for the interconnect density that high-bandwidth workloads require. Successful implementation depends on control of surface chemistry and surface topography — clean ...