Researchers at UCLA published a technical paper titled “Can Agents Design Better Chips with a Higher Level Abstraction?” ...
Researchers at the University of Wisconsin–Madison and Marist University published a technical paper titled “Demystifying ...
Researchers at Georgia Tech, Nvidia Research, and Stanford University published a technical paper titled “BOOST: Concurrent Access to Host Memory and HBM to Accelerate LLM Inference.” Abstract Excerpt ...
As AI systems scale, advanced power delivery innovations are becoming critical to performance, efficiency and reliability.
Package twins must track what manufacturing actually builds, not just design intent. Missing process and supplier data can ...
A scalable LPDDR-based memory platform optimized for edge AI inferencing.
Increasingly complex chip designs require more test data than those developed at older nodes and on single planar dies. The ...
Warpage is becoming a bigger constraint as package, interposer, and panel sizes grow. Negative thermal expansion (NTE) ...
Intel may be the marquee name, but materials suppliers, packaging hubs, and quantum startups will determine whether the region becomes a true semiconductor ecosystem.
How advanced NoC architectures and coherent subsystem IP can address the industry's next-gen scalability, safety, and ...
First-silicon success falls; engineering capacity; minimum clock period; optimizing PyTorch; counterfeit electronics.
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