Technology is only useful if it improves an existing methodology. Property generation is still refining that goal, but in the ...

Physics-based analysis becomes more consequential as chips, packages, boards, and systems are designed together.

Shift left is becoming less linear. Instead of locking down specifications early, design teams may be able to refine ...

Advanced packaging requires models to cross company boundaries without exposing proprietary processes, but hiding too much ...

Pinpointing failures, ensuring known-good optical engines, and controlling test costs become increasingly critical as ...

STCO for heterogeneous design; physical AI interactions; signing off AI-generated designs; workload profile analysis.

Solving difficult bugs while intelligently deciding what to investigate, what to rerun, and where to spend compute.

This is the third article in a series examining what it takes to build production-ready AI agents for EDA. The first explored the architectural decisions required for agents to operate reliably in ...

Technical Paper Research Organizations; Beyond HBM-on-GPU: Thermal Design Envelope for 3D Volumetric DRAM-on-GPU Integration: imec: Self-Heating and Parasitic Effects in Multi-Tie ...