AI power prediction; large-area FPCBs; graphene vibrations.
Semiconductor engineering teams have long relied on an iterative simulation workflow: define the scenario, prepare the model, ...
A new technical paper, “Nonvolatile photonic field-programmable coupler array,” was published by researchers at University of ...
New in-vehicle networking technology will likely take over as more AI is added, but in the near term designers face ...
A new technical paper, “Highly energy-efficient manifold microchannel for cooling electronics with a coefficient of ...
A new technical paper, “Rethinking Compute Substrates for 3D-Stacked Near-Memory LLM Decoding: Microarchitecture-Scheduling ...
Interface IP in 3D; SOCAMM in data centers; edge intelligence implementations; deposition, etch for 3D; interconnect ...
If you’re working on SoCs at 2 nm or below, you know DRC is a different beast these days. Early in the design, it’s common ...
Current approaches involve multiple tools, vendors, designs, data formats, and abstractions. Can agents really use them all?
Complex chips need coherent and non-coherent sub-NoCs to ensure efficient data paths. Correct hierarchy is essential.
But the inability to utilize leading-edge process nodes has created opportunities for small and midsize chip developers in ...
Traditional simulations lack an understanding of clocking requirements and cannot handle the complete clock network of a ...
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