Advanced node manufacturing and heterogeneous integration require partnerships that span the full value chain.
Standalone GPUs are being replaced by heterogeneous SoCs and chiplets that combine CPUs, GPUs, and NPUs to eliminate memory ...
Yu Ma. As AI-driven workloads continue to push the boundaries of compute scale, power efficiency, and bandwidth density, ...
PCIe remains a critical technology for non-AI processing. For AI, PCIe will be strengthened by scale-out, agentic AI, and ...
The verification gap emerges not from a lack of computational power but from the multiphysics nature of 3D-IC behavior.
Ayar Labs and Wiwynn A CPO link is in one direction from the driving laser through the optical engine (OE) on the XPU, ...
This post addresses the specific hurdle of effective and efficient manufacturing tests for these complex devices. It outlines ...
Analog behavior is difficult to compress into simple pass/fail decisions that could reduce redundant coverage.
In-field testing is essential for quickly detecting emerging defects throughout a device's operational lifespan.
A new architecture enables higher data rates and densities while remaining pin-compatible with traditional DIMM.
How agents can be used to divide and conquer IC design problems.
As AI models drive compute demand, servers keep getting bigger. Rack‑scale AI systems (such as the 72-GPU systems from NVIDIA or AMD) enable many GPUs to work together through system-level ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results