DFT’s mission is to enable a consistent way of testing chips post-manufacturing. But with an HBM stack, it also needs to ...

Heterogeneous integration does not simply increase complexity but redistributes where quality must be assured.

A smaller set of fiber connectors that meet manufacturing test high insertion count will ease the cost burden for all. Test specifications and associated standardized test formats will facilitate data ...

An imec researcher published a technical paper titled “Bond Front Velocity in Lubrication-Mediated Bonding of Flexible ...

Compute clusters offer more processing capacity but at the cost of higher power. Software is needed to allocate resources ...

NASA’s lunar network will leverage Delay/Disruption Tolerant Networking to maintain signal integrity between rovers, astronauts, satellites, and more. 4G/5G LTE RF and optical inter-satellite links ...

Semiconductor leaders say hardware trust, verification, and lifecycle resilience must become core design requirements rather than late-stage additions.

AI has pushed security to the forefront, helping attackers find vulnerabilities in chips and the chip industry to defend against them. Security needs to extend throughout a chip’s lifetime, but it’s ...

Explore how designers can build safer, smarter humanoid robots-covering motor control, main compute, zone control, battery management, charging and sensing. Download the application presentation to ...

How to build a CRA compliance strategy that connects regulatory obligations with secure engineering practices, lifecycle ...

Researchers from MIT, SLAC, Stanford University, and Argonne National Laboratory published a technical paper titled “Spatiotemporal mapping of anisotropic thermal transport in GaN thin films via ...