Tools are currently built with a defined notion of how they will be used. For agentic solutions they will be transformed into collections of callable engines. Agents may be built by EDA companies for ...

AI-driven compute demands have led to several distinct supply chain bottlenecks for data centers. Legacy power management ...

Photonics is forcing EDA to verify not just chips, but the physics of light inside full electro-optical systems.

Scaling NoCs across chiplets requires earlier validation of coherency, congestion, thermal effects, and fault behavior.

As systems become more advanced, engineering intelligence cannot remain fragmented across isolated AI models that only ...

You probably know this bottleneck too well: full transistor-level or physical simulations—whether analog circuit, electromagnetic, or thermal—can take weeks or even months. For complex designs, ...

A circuit can look perfect on day one and still drift out of specification after months or years of electrical and thermal stress. That is the reliability problem in a nutshell: the design does not ...

Near-memory HBM for LLM inference; processing-in-memory for 3D DRAM; SDV hardware abstraction; 3nm GAAFET SRAM self-heating ...

Hyperspectral imaging is making a difference in surgery, disease diagnostics, and water conservation. Inverse lithography technology (ILT) finds a new application in reticle stitching. Leaders are ...

Securing physical AI; agents need feedback; 3D-IC security; chiplet interoperability; RF digital twins.