Researchers from MIT, SLAC, Stanford University, and Argonne National Laboratory published a technical paper titled “Spatiotemporal mapping of anisotropic thermal transport in GaN thin films via ...

Both approaches scale toward packages as large as 240 mm x 240 mm, with a roadmap extending beyond 12x reticle integration ...

Semiconductor leaders say hardware trust, verification, and lifecycle resilience must become core design requirements rather than late-stage additions.

Compute clusters offer more processing capacity but at the cost of higher power. Software is needed to allocate resources ...

Implementing the Cyber Resilience Act: Practical Guidance for Security Engineering and Compliance is a practical eBook designed to help product manufacturers, security teams, compliance leaders, and ...

Many security architectures rely on immutable ROM as the first trusted code executed by a processor. It provides a stable foundation for authenticating the rest of the boot chain, but that same ...

Switchable analog, digital organic transistor; thread-based ICs; temporary e-tattoo electrodes.

AI integration is accelerating aging in automotive sensors and other components. AI-powered systems must be built through meticulous, advanced model testing, but they also must adapt to future AI ...

Researchers from Technische Universität Dresden and University of Manchester published a technical paper titled “The SpiNNaker2 Chip: A Many-Core Platform for Flexible and Scalable Brain-Inspired ...

This dual challenge — cybersecurity and functional safety—is captured in two landmark standards: ISO 26262 for functional ...