Researchers from Georgia Institute of Technology published a technical paper titled “Thermal Tuning Overhead in Wafer-Scale ...

Researchers from Peking University, Chinese Academy of Sciences et al. published a technical paper titled “Homo-metal-element ...

Researchers from University of Michigan-Dearborn published a technical paper titled “Generative Design of Liquid-Cooling ...

Researchers from Stanford University and SLAC National Accelerator Laboratory published a technical paper titled “Deep ...

Researchers from University of California, Los Angeles published a technical paper titled “An Open-Source Benchmark Suite of 3D-IC Testcases.” Abstract Excerpt: The paper presents an “open-source ...

AI is supposed to be the answer to this. But for many teams, the AI conversation stalls before it starts, because it gets ...

Can LLMs turn a specification into a set of formal properties that can be used to verify an implementation? The answer is ...

Advanced-node design to reduce iterations and improve correlation for DTCO-focused advanced AI and HPC designs.

Many digital standards, like USB4 Version 2.0 (USB4v2), LPDDR6, and PCIe 6.0, are getting more complex and time-consuming to ...

Three new, economical, and scalable platforms, triggered by the convergence of AI-related hardware needs, new process ...

Effective substrate implementation is crucial for signal integrity, power delivery, and overall system reliability.

Discover bugs that neither constrained-random simulation nor model-heavy equivalence flows are structurally capable of ...