Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet systems” was published by researchers at EPFL and ...

A new technical paper titled “LLM-based Behaviour Driven Development for Hardware Design” was published by researchers at ...

Researchers from the University of Southern California Information Sciences Institute and the University of Wisconsin-Madison ...

A new technical paper titled “A Tensor Compiler for Processing-In-Memory Architectures” was published by researchers at ...

A new technical paper titled “A review of the thermo-mechanical analysis framework for microelectronics packaging: Mechanics, ...

Previous studies have shown that In10Ag TIMs outperform polymer-based TIMs in both end-of-line (EOL) testing and long-term ...

Relying solely on end-of-line testing isn't enough when security, traceability, and mission reliability are vital.

A new technical paper titled “Breaking ECDSA with Electromagnetic Side-Channel Attacks: Challenges and Practicality on Modern ...

Left-shifting DFT, scalable tests from manufacturing to the field, enabling system-level tests for in-field debug.

A new technical paper titled “A Vertically Integrated Framework for Templatized Chip Design” was published by researchers at ...

Machine learning tools can accelerate all stages of materials discovery, from initial screening to process development.

There are challenges and solutions for processing AI workloads on-device to achieve consistent performance, reduce costs, and ...