Warpage is shifting from a global bow specification to a process-dependent surface-shape problem that affects bonding, alignment, lithography, reliability, and downstream assembly. Panel-level ...

HW methods to throttle AI; M3D DRAM; interconnect signal-integrity analysis; 3D mask effects in high/hyper-NA EUV litho; ...

This research is significant in that it proposes a new design principle that allows the flow of light within photonic ...

The use of AI agents in chip design has been limited to small portions of the design flow. Engineers have been proceeding cautiously to understand how agents work, how to ensure they are delivering ...

As semiconductor devices become increasingly central to automotive, industrial, aerospace, medical, and other safety-critical applications, functional safety has evolved from a specialized engineering ...

You probably know this bottleneck too well: full transistor-level or physical simulations—whether analog circuit, electromagnetic, or thermal—can take weeks or even months. For complex designs, ...

A circuit can look perfect on day one and still drift out of specification after months or years of electrical and thermal stress. That is the reliability problem in a nutshell: the design does not ...

Joo-Ann Beh is a solution manager at Keysight Technologies, focusing on health care solutions within the General Electronics Measurement Solutions group. She began her ...