Standalone GPUs are being replaced by heterogeneous SoCs and chiplets that combine CPUs, GPUs, and NPUs to eliminate memory ...

Low-latency fabrics, topology-aware scheduling, and tiered memory bring compute closer to data and reduce coordination ...

A new architecture enables higher data rates and densities while remaining pin-compatible with traditional DIMM.

Ayar Labs and Wiwynn A CPO link is in one direction from the driving laser through the optical engine (OE) on the XPU, ...

This post addresses the specific hurdle of effective and efficient manufacturing tests for these complex devices. It outlines ...

Analog behavior is difficult to compress into simple pass/fail decisions that could reduce redundant coverage.

How agents can be used to divide and conquer IC design problems.

We have started to see what may be the largest disturbance in the role of a verification engineer since the founding of the ...

In-field testing is essential for quickly detecting emerging defects throughout a device's operational lifespan.

Advanced node manufacturing and heterogeneous integration require partnerships that span the full value chain.

Researchers at Pohang University of Science & Technology (POSTECH) developed a zinc oxide (ZnO) and tellurium (Te) ...

A roadmap for operationalizing AI at scale and achieving sustained competitive advantage across the semiconductor lifecycle.