Standalone GPUs are being replaced by heterogeneous SoCs and chiplets that combine CPUs, GPUs, and NPUs to eliminate memory ...

Scaling to tens of millions of CPO units per year requires the industry to first settle on automated, cost-effective methods ...

PCIe remains a critical technology for non-AI processing. For AI, PCIe will be strengthened by scale-out, agentic AI, and ...

The verification gap emerges not from a lack of computational power but from the multiphysics nature of 3D-IC behavior.

We have started to see what may be the largest disturbance in the role of a verification engineer since the founding of the ...

Ayar Labs and Wiwynn A CPO link is in one direction from the driving laser through the optical engine (OE) on the XPU, ...

This post addresses the specific hurdle of effective and efficient manufacturing tests for these complex devices. It outlines ...

Analog behavior is difficult to compress into simple pass/fail decisions that could reduce redundant coverage.

In-field testing is essential for quickly detecting emerging defects throughout a device's operational lifespan.

A new architecture enables higher data rates and densities while remaining pin-compatible with traditional DIMM.

Advanced node manufacturing and heterogeneous integration require partnerships that span the full value chain.

Researchers at Pohang University of Science & Technology (POSTECH) developed a zinc oxide (ZnO) and tellurium (Te) ...