Precision Time Measurement; blockchain-based traceability; simulation in space; 6G PHY co-design.

Researchers from Micron Technology and Argonne National Laboratory have released “Understanding Inference Scaling for LLMs: ...

Advanced nodes and packaging AMD announced more than $10B in Taiwan ecosystem investments to scale advanced packaging manufacturing for AI infrastructure. The effort includes EFB-based 2.5D packaging ...

Sustaining AI progress requires energy-efficient computing with holistic co-design and co-optimization across the entire ...

Temperature adds another challenge. Standard DFT is essentially a zero-temperature approach, so thermal effects must be ...

In-Depth Semiconductor Engineering published the Manufacturing, Packaging & Materials newsletter this week, with these top stories: With Chiplets, What Role Does Economics Play? Low-Temp Solders Are ...

For the data center, chiplet economics matter, but they’re not a primary decision-driver. With the exception of processor families, chiplets cannot address consumer markets today, where economics ...

Founded in 1981 by a group of ex-Intel employees. They identified a need for computer aided design (CAD) tools to be used for designing printed circuit boards (PCBs) and integrated circuits (ICs).

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