The demand for performance in an AI data center is causing a huge spike in the amount of power being consumed. Within a rack ...
Verification IP; system-technology co-optimization; PCIe 7.0 ordering; design data challenges; process digital twins.
New research points to safer devices with less loss at low voltages, but problems remain for high-voltage industrial ...
Researchers from Arizona State University and Intel Foundry have published “Graph Attention-Based Virtual Metrology for Film ...
We employ a straightforward stacking approach to integrate ultrathin materials with metasurfaces, overcoming the technical ...
How the standard matured from simple connectivity to secure data movement across multiple chiplets and packaging approaches.
Reducing variation in manufacturing, monitoring behavior over time, and targeting specific workloads can have a big impact on ...
Multi-die assemblies give chip architects the option to change some dies while keeping the rest of the system intact, but ...
A modular approach for combining specialized chiplets and speeding time to market.
Over the past decade or so, foundation models have emerged as the dominant paradigm for interacting with language, images, ...
Every new SoC tape-out demands broader coverage for design robustness, and the characterization workload has exploded. The ...
Agentic verification provides flow orchestration for common repetitive tasks. Capabilities will expand when tools can learn from a larger context, including the specification. Design houses need to ...
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