Advanced packaging requires models to cross company boundaries without exposing proprietary processes, but hiding too much ...

STCO for heterogeneous design; physical AI interactions; signing off AI-generated designs; workload profile analysis.

Researchers at Chinese Academy of Sciences, Jilin University, State Key Laboratory of Advanced Manufacturing for Optical ...

For FA, engineers need to identify boundaries and be able to decouple individual components to identify the root cause of problems. Underperforming lasers are a substantial issue, making the “golden ...

Researchers at Arizona State University and University of Maryland published “SEAL: Multitenant Security-Aware Layer Mapping for Heterogeneous 3-D CiM Accelerators.” Abstract: “Heterogeneous 3-D ...

Researchers from Institute of Science Tokyo, Yokohama National University, AIST, and Photonics Electronics Technology Research Association (PETRA) published a technical paper titled “Reduced-DSP ...

Researchers at KU Leuven, Kunsan National University, Vrije Universiteit Brussel, imec, et al. published “Irradiation-Source-Dependent Tone Conversion in Dry-Deposited Halogenated Amorphous Zeolitic ...

Based Transistor Modeling for Ultra-Fast SPICE Simulation and Standard Cell Library Characterization.” Abstract: “Neural network (NN)-based transistor models have proven to be a promising solution to ...

Moving advanced packaging from wafer to panel changes more than available area. Processes developed around wafer geometry, handling, and equipment have to be reconsidered at panel scale. Larger panels ...

At the recent SPIE Photomask Technology + Extreme Ultraviolet Lithography conference, an expert panel discussed the growing importance of edge placement error (EPE ...

Foundries have been doing backend work for advanced packages. OSATs are now taking that on. This particularly affects 2.5D and panel assembly with new equipment and materials. Hybrid bonding is mostly ...