The 2026 IEEE Electronic Components and Technology Conference (ECTC) showcased how advanced packaging can redefine the scalability limits of artificial intelligence (AI) and high-performance computing ...

As threats evolve faster, protecting security algorithms from design through manufacturing and across the supply chain is ...

The ability to effectively combine compute, AI, and graphics will become a key differentiator for platform competitiveness.

Replicate real-world operating conditions to determine how much margin there is and what happens when operating conditions ...

A hardware fault injection attack results in the first Xbox One boot ROM-level compromise after 12 years.

Modern edge devices demand heterogeneous AI architectures that can mix and match subsystems to accelerate different aspects ...

To deliver increased processor performance for engine and body control systems, one leading semiconductor supplier knew it ...

What does this mean for smart homes? For years, we have known that software and firmware usually have many bugs, and some of ...

Researchers from ETH Zurich and University of Bologna have released “CHIMERA: A Flexible and Scalable 3.1 TOPS/W AI-MCU with ...

How to achieve reliable near-threshold operation while accelerating design convergence and meeting aggressive PPA targets.

The demand for performance in an AI data center is causing a huge spike in the amount of power being consumed. Within a rack ...

PAC, PNoise, and PXF—allow designers to dissect circuit performance with precision, accurately modeling frequency conversion, ...