Researchers from Technische Universität Dresden and University of Manchester published a technical paper titled “The SpiNNaker2 Chip: A Many-Core Platform for Flexible and Scalable Brain-Inspired ...

Switchable analog, digital organic transistor; thread-based ICs; temporary e-tattoo electrodes.

Today’s most advanced AI systems rely on larger, more complex assemblies of dies and chiplets from multiple process nodes and ...

The energy and buzz at this year’s Design Automation Conference surprised everyone — despite initial concerns about its location in Long Beach, California, which is well off the beaten path for ...

A cluster comprises a group of interconnected servers (aka nodes) across multiple racks, connected via Ethernet and increasingly via optical links, and is ideal for workloads that are so large and ...

Warpage is shifting from a global bow specification to a process-dependent surface-shape problem that affects bonding, alignment, lithography, reliability, and downstream assembly. Panel-level ...

Synopsys’ Greg Sorber finds that the next era of compute will be defined less by raw speed and more by architectural intelligence, the abstraction of hardware complexity, and the co-design of silicon, ...