Reducing variation in manufacturing, monitoring behavior over time, and targeting specific workloads can have a big impact on ...

Multi-die assemblies give chip architects the option to change some dies while keeping the rest of the system intact, but ...

Every new SoC tape-out demands broader coverage for design robustness, and the characterization workload has exploded. The ...

As high-NA EUV approaches, mask makers need new metrics, model-based checks, and curvilinear-native data flows to keep turn ...

Researchers from Yale University, Cornell University, Boston University, and NTT Research have published “Physical Foundation Models: Fixed hardware implementations of large-scale neural networks”.

Thermal management has become the defining bottleneck in high-performance computing (HPC) and AI accelerator packaging. Modern packages integrate high-power ASICs with multiple High Bandwidth Memory ...

Over the past decade or so, foundation models have emerged as the dominant paradigm for interacting with language, images, ...

Semiconductor Engineering sat down to discuss memory interfaces, interconnects, and memory access scaling with Madhumita Sanyal, senior director of technical product management at Synopsys; Swadesh ...

Researchers from Micron Technology and Argonne National Laboratory have released “Understanding Inference Scaling for LLMs: ...

Precision Time Measurement; blockchain-based traceability; simulation in space; 6G PHY co-design.

Cerebras’ IPO is a meaningful moment for the semiconductor industry — and not just for the financial implications. Their confidence in their opening price reflects something the industry has ...

Avant! Corporation was an electronic design automation software company that spent its life in litigation with Cadence over the theft of code. This eventually was proven to be true. However, during ...