AI power prediction; large-area FPCBs; graphene vibrations.
Semiconductor engineering teams have long relied on an iterative simulation workflow: define the scenario, prepare the model, ...
A new technical paper, “Nonvolatile photonic field-programmable coupler array,” was published by researchers at University of ...
New in-vehicle networking technology will likely take over as more AI is added, but in the near term designers face ...
A new technical paper, “Rethinking Compute Substrates for 3D-Stacked Near-Memory LLM Decoding: Microarchitecture-Scheduling ...
A new technical paper, “Highly energy-efficient manifold microchannel for cooling electronics with a coefficient of ...
A new technical paper, “Epoxy Composites Reinforced with Long Al2O3 Nanowires for Enhanced Thermal Management in Advanced ...
If you’re working on SoCs at 2 nm or below, you know DRC is a different beast these days. Early in the design, it’s common ...
Interface IP in 3D; SOCAMM in data centers; edge intelligence implementations; deposition, etch for 3D; interconnect ...
A Fault-Tolerant Compiler for Chiplet Quantum Architectures,” was published by researchers at the Technical University of ...
AI has become a key driver for the semiconductor industry as it is applied to ever more aspects of daily life. Many startups and established vendors are designing AI chips to accelerate algorithms and ...
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