Intel’s expansion; Cadence AI super agent for PCB, advanced packaging; photonics fab wars; earlier Yongin fab; German funding; new CHIPS Act award; HBM standard; Quadric funding; AMS acquisition; ...

AI opens the door to exploring a much larger solution space, similar to what high-level synthesis did years ago, but ...

Newer nonvolatile memory (NVM) technologies are poised to take over from flash in embedded applications on newer process ...

An Industry 4.0 technology roadmap for semiconductor device makers that covers carbon emissions, water, and hazardous waste.

Hybrid bonding already works in production, but finer-pitch die-to-wafer integration must preserve fab-level surface and ...

A realistic virtual model uncovers the impact of rounded corners on sensitivity to overlay-induced resistance.

Investors kept pouring money into AI hardware startups in the second quarter of 2026. While companies focused on chips for AI data centers have largely dominated the funding over the past year, ...

Researchers from Georgia Institute of Technology published a technical paper titled “Open DRAM Model—Part II: Enabling ...

Worldwide EDA, semiconductor IP, and services revenue reached $5.748 billion in Q1 2026, a 12.7% increase compared to the same period in 2025. The key driver continues to be demand for tools used to ...

Researchers from Northwestern University and University of Illinois at Chicago developed a cerebellum-inspired memtransistor for anomaly detection that ignores expected inputs and rapidly detects ...

Moving from large language models in the cloud to small language models at the edge is much more complicated than just slimming down the algorithms. It requires changes in both hardware and software, ...