Researchers from Yale University, Cornell University, Boston University, and NTT Research have published “Physical Foundation Models: Fixed hardware implementations of large-scale neural networks”.

Thermal management has become the defining bottleneck in high-performance computing (HPC) and AI accelerator packaging. Modern packages integrate high-power ASICs with multiple High Bandwidth Memory ...

Every new SoC tape-out demands broader coverage for design robustness, and the characterization workload has exploded. The ...

Exhaustive proofs are the only way to find deep corner-case bugs that can result in deadlocks and silent data corruption.

Multi-die assemblies give chip architects the option to change some dies while keeping the rest of the system intact, but which is best to keep?

As high-NA EUV approaches, mask makers need new metrics, model-based checks, and curvilinear-native data flows to keep turn ...

Over the past decade or so, foundation models have emerged as the dominant paradigm for interacting with language, images, ...

Details Event Category: Events Location: Santa Clara Website: https://pr.tsmc.com/english/events/tsmc-events ...

Cerebras’ IPO is a meaningful moment for the semiconductor industry — and not just for the financial implications. Their confidence in their opening price reflects something the industry has ...

Researchers from Micron Technology and Argonne National Laboratory have released “Understanding Inference Scaling for LLMs: ...

Precision Time Measurement; blockchain-based traceability; simulation in space; 6G PHY co-design.

Advanced nodes and packaging AMD announced more than $10B in Taiwan ecosystem investments to scale advanced packaging manufacturing for AI infrastructure. The effort includes EFB-based 2.5D packaging ...