AI scalability will require full-stack co-optimization, not just bigger data centers. AI workloads require a 10X compute efficiency gain over 10 years, making collaboration across algorithms, ...
A researcher from the Okinawa Institute of Science and Technology (OIST) proposes redesigning the illumination systems and projectors used in high-NA EUV lithography to reduce optical effects and ...
Supports higher throughput, reduced cycle time, and lower cost per package, while enabling integration of increasingly ...
On-die monitors, localized analytics, and lifecycle data are giving architects new ways to close the gap between design ...
Mask costs are not stopping leading-edge scaling, but they increasingly influence design, node, and process choices. High-NA EUV will tighten requirements for CD, EPE, local CDU, mask 3D modeling, ...
When is a complex chip design ready to be shipped to manufacturing?
NVMe on-controller memory; SSN datapaths; Git-based chip workflows; low-light image enhancement; testing AI networks.
Hybrid bonding can result in a package containing billions (and eventually trillions) of connections. Building that many connections successfully requires extreme process uniformity across a wafer.
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