This research is significant in that it proposes a new design principle that allows the flow of light within photonic ...

HW methods to throttle AI; M3D DRAM; interconnect signal-integrity analysis; 3D mask effects in high/hyper-NA EUV litho; ...

Modern engineering software was built around an assumption that made sense for its time: different physics problems required different tools, solvers, and workflows. Structural analysis lived in one ...

Change is coming, but how quickly depends on the availability of data and when chipmakers are confident enough to let AI take over.

Scaling NoCs across chiplets requires earlier validation of coherency, congestion, thermal effects, and fault behavior.

As we’ve observed over our recent blogs, the semiconductor industry is reckoning internally with technological questions on densification, scale, overcoming the memory wall, making data movement more ...

Photonics is forcing EDA to verify not just chips, but the physics of light inside full electro-optical systems.

Multi-chiplet packages contain thousands of connections between chiplets, interposers, and package BGAs. After optimizing this complex connectivity, designers must identify related signal groups ...

You probably know this bottleneck too well: full transistor-level or physical simulations—whether analog circuit, electromagnetic, or thermal—can take weeks or even months. For complex designs, ...

A circuit can look perfect on day one and still drift out of specification after months or years of electrical and thermal stress. That is the reliability problem in a nutshell: the design does not ...