At the recent Data Center World 2026 in Washington, D.C., one message came through louder than ever: AI infrastructure is ...
ChipAgents has introduced Renoir, an agentic large language model (LLM) whose name means “renew.” In early chip design ...
A designer’s choice of I/O connectors and interconnect protocols can be the difference between a massively profitable AI chip and a flop. I/O tradeoffs impact airflow, cooling, rack design, power ...
AI scalability will require full-stack co-optimization, not just bigger data centers. AI workloads require a 10X compute efficiency gain over 10 years, making collaboration across algorithms, ...
In Part 1, we looked at the innovations underpinning the Cerebras WSE-3 and why its most significant breakthrough is the elimination of data movement overhead at the architectural ...
As System-on-Chip (SoC) designs become increasingly complex, engineering teams face growing challenges coordinating hardware and software development across multiple domains. Today’s projects require ...
Researchers from Nagoya University, Boise State University, Korea Institute of Fusion Energy, Hitachi High-Tech Corp. and Princeton Plasma Physics Laboratory published a technical paper titled “Recent ...
As chiplet-based architectures gain traction across high-performance and cost-sensitive semiconductor applications, selecting the appropriate die-to-die interconnect standard has become a critical ...
A researcher from the Okinawa Institute of Science and Technology (OIST) proposes redesigning the illumination systems and projectors used in high-NA EUV lithography to reduce optical effects and ...
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