As interconnect pitches between hybrid bonds approach 5 µm and below, 50 nm particles and surface contamination, as well as ...

Frank Ferro, group director for product management at Cadence, explains why data hierarchies are so critical for physical AI, ...

Manufacturers are using test data and predictive models to identify marginal chips and determine when additional screening is ...

Autonomous machines promise to transform industries, but memory bottlenecks, power constraints, specialized architectures, ...

SE: AI is disruptive to EDA, the semiconductor industry, and to their customers. One early indication is that computer ...

Accurate SI analysis must account for interactions across vertical interconnects, interposers, silicon bridges, package transitions, and neighboring high-speed channels.

There is much disagreement on the timing of the transition from copper interconnects to optical interconnects, but almost everyone agrees we are moving to all-optical interconnects over the next five ...

The first step in right-sizing an AI model for an embedded application is determining its purpose, including the target device functions and product features. Designers typically use a mix of ...