Integrating 2D materials into sustainable electronic devices presents key challenges, particularly in depositing or etching ...

The case study is about providing a sustainable solution to reduce the failure rate of devices due to clip lifted issues.

As packaging integrates diverse substrates, adhesives, and exotic metals, manufacturers must rethink precision from the ...

Stacking glass for high-frequency applications Glass is ideal for 6G wireless communication networks, which must support >100 ...

Molybdenum is looking increasingly promising as a replacement for a variety of metals commonly used in semiconductor ...

IP can no longer be developed and verified outside of the context of the system in which it is expected to operate — unless we develop new verification methodologies.

Cadence’s Jasmine Makhija provides an overview of the TEE Device Interface Security Protocol (TDISP), which helps safeguard ...

A new technical paper titled “Automatically Retargeting Hardware and Code Generation for RISC-V Custom Instructions” was ...

Stealthy Secret Extraction using Undervolting-based Static Side-channel Attacks” was published by researcher at Worcester Polytechnic Institute and Ruhr University Bochum. Abstract: “Static ...

A Scalable Framework for Resilient Memory Design” was published by researchers at University of Central Florida, University ...

A new technical paper titled “Hardware Acceleration of Kolmogorov-Arnold Network (KAN) in Large-Scale Systems” was published ...

Optimization Pathways for Long-Context Agentic LLM Inference” was published by researchers at University of Cambridge, ...