Conduct literature reviews and study state-of-the-art methods in robotics, control, estimation and simulation ...

A new semiconductor integration platform combines dense chip packaging, faster interconnects and thermal analysis to tackle key challenges in next-generation AI hardware systems more efficiently. A ...

Researchers have developed a wafer-integrated approach that combines antennas and semiconductor switches, potentially reducing manufacturing complexity while ...

A new semiconductor device gives AI hardware short-term memory while naturally clearing older inputs, potentially enabling faster, lower-power processing for ...

Can AI solve the heat problem it helped create? A swarm of agents is searching atomic structures for materials that could keep chips cooler.

A low-power smart packaging system could help pharmacists verify medicine storage histories, reduce unnecessary pharmaceutical waste, and enable safer future prescription medicine reuse pathways.

Elecrow has launched the ThinkNode M9, a standalone communication terminal that runs MeshCore firmware over a Long Range (LoRa) radio link.