Conduct literature reviews and study state-of-the-art methods in robotics, control, estimation and simulation ...

A new semiconductor integration platform combines dense chip packaging, faster interconnects and thermal analysis to tackle key challenges in next-generation AI hardware systems more efficiently. A ...

Researchers have developed a wafer-integrated approach that combines antennas and semiconductor switches, potentially reducing manufacturing complexity while ...

A new semiconductor device gives AI hardware short-term memory while naturally clearing older inputs, potentially enabling faster, lower-power processing for ...

Can AI solve the heat problem it helped create? A swarm of agents is searching atomic structures for materials that could keep chips cooler.

A low-power smart packaging system could help pharmacists verify medicine storage histories, reduce unnecessary pharmaceutical waste, and enable safer future prescription medicine reuse pathways.

Elecrow has launched the ThinkNode M9, a standalone communication terminal that runs MeshCore firmware over a Long Range (LoRa) radio link.

A micro fan could help smart glasses manage heat from processors, cameras, and displays while keeping the design compact.

A programmer wrote a fully playable DOS solitaire game that fits in 3 KB, small enough to be stored in a printed QR code and loaded ...

A Cyprus-based startup has unveiled a desktop machine that promises to fabricate, assemble, and test a working circuit board prototype ...

Google’s LiteRT toolkit lets a Raspberry Pi 5 run compact Gemma language and vision models locally, without sending inference to a cloud service.

A new approach to AI connectivity could let system designers change their hardware choices without redesigning the board.