Vishay Intertechnology, Inc. has introduced a new space-grade, surface-mount common mode choke designed to provide ...

As high-speed packaging lines and robotic systems continue to increase in speed, precision and autonomy, weighing is evolving ...

Under the deal, Microchip will help Everspin augment its domestic U.S. manufacturing capacity for MRAM and tunnel magnetoresistive (TMR) sensor products. Microchip will establish an MRAM line to ...

The dual outlet is designed for currents of up to 16 A at 250 V AC according to IEC and 20 A at 250 V AC according to UL. It ...

While the HONOR Robot Phone leans into “emotional interaction” and AI-driven movement, RugOne is betting on modular ...

Sony Electronics Inc.’s lidar depth sensor, which is claimed to be the smallest and lightest sensor in the sector, is ...

With its innovations and forward-looking technologies, LAPP invites attendees to shape the industrial future together at ...

Both meet high-reliability 100% screening tests, but the HR versions include the enhanced MIL-STD-750 Group B tests that ...

Intel Corp. is joining SpaceX and Tesla’s project to build a Terafab in the U.S. in what could be a boon for its foundry ...

Three new semiconductor teaching lab solutions have been designed by Keysight Technologies, Inc., to help universities ...

The semiconductor market surpassed $830 billion in 2025, the second consecutive year of more than 20% annual revenue growth due to the demand for AI-related technologies, according to new data from ...

According to a report in Wired, Google and Amazon are in advanced talks with Intel on its advanced packaging foundry services for custom AI chips. These chips will likely be used ...