As compute architectures evolve to support increasingly data‑intensive workloads, the role of high‑speed I/O has never been more critical. Artificial intelligence, high‑performance computing, ...
Ajinomoto build-up film (ABF) substrate has been a key component in chip manufacturing since its introduction shortly before the turn of the millennium. Substrates made with Ajinomoto build-up film – ...
Ayar Labs and Wiwynn A CPO link is in one direction from the driving laser through the optical engine (OE) on the XPU, ...
Standalone GPUs are being replaced by heterogeneous SoCs and chiplets that combine CPUs, GPUs, and NPUs to eliminate memory ...
Advanced node manufacturing and heterogeneous integration require partnerships that span the full value chain.
Supports higher throughput, reduced cycle time, and lower cost per package, while enabling integration of increasingly ...
PCIe remains a critical technology for non-AI processing. For AI, PCIe will be strengthened by scale-out, agentic AI, and ...
On-die monitors, localized analytics, and lifecycle data are giving architects new ways to close the gap between design ...
Researchers from Google and University of California, Berkeley published a technical paper titled “Google’s Training ...
Researchers from University of Wisconsin-Madison and AMD Research and Advanced Development published a technical paper titled ...
When is a complex chip design ready to be shipped to manufacturing?
Researchers from Seoul National University, Stanford University, and Chinese Academy of Sciences developed an ...
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