Engineers across automotive, industrial and AI infrastructure are increasingly adding 48V distribution alongside traditional ...

Flash Memory: For standard Matter end-devices, a memory range of 2 to 4 MB is required (a stack of the Matter SDK, device ...

As AI workloads evolve toward inference and agentic AI, the criteria for system performance are also changing. Computing power alone is no longer enough. Where data is stored, how quickly it moves, ...

On August 24, KM Lim, CTO of BOS Semiconductors, will present Eagle-N during the Automotive session, introducing BOS Semiconductors’ next-generation automotive AI semiconductor technology. We look ...

Sydney, Australia — Perceptia Devices, a leader in high-performance clocking IP, today announced the availability of the design kit for its pPLL03 phase-locked loop IP on Samsung Foundry’s 14LPU ...

Index Terms, AMBA CHI, network-on-chip, directory-based snoop filter, DMT, DCT, DWT, RN-F, HN-F, AXI to CHI bridge, IOMMU, topology generation, PCIe 6.x, CXL 3.x, Flex Bus, multi-core SoC, CPU cluster ...

By Asma Adhimi, eenewseurope.com India is stepping up its semiconductor ambitions as it moves from attracting major investments to building a broader domestic ecosystem spanning chip design, ...

Samsung Electronics is raising prices for some advanced contract chipmaking services by as much as 15% as the global artificial intelligence boom tightens manufacturing capacity and gives the South ...

Rapidus has laid out its advanced packaging roadmap at the 2026 OCP APAC Summit, with eight-reticle-size interposers and 600 x 600 mm panel-level processing as the targets for around 2030. The roadmap ...

Synopsys announced what it calls the industry's first complete CXL 4.0 IP solution, combining a controller, security modules, a silicon-proven PHY, and verification IP for the latest generation of the ...

As software becomes the primary factor determining vehicle value, the software-defined vehicle (SDV) is shifting from a buzzword into an implementation premise. An SDV is not a fixed architecture ...

TSMC has completed development and validation of its next-generation 1.6-nanometer-class A16 process and will begin mass production in the fourth quarter of this year. A16 is the first angstrom-class ...