Design And Reuse

BEVFormer-Tiny on Chimera: Bird's-Eye-View Perception in One GPNPU Kernel

BEVFormer-Tiny runs its neural-network stages in one Chimera GPNPU kernel. Six camera inputs, 16.1 million cycles per frame ...
Design And Reuse

Tape-Out Readiness Checklist: Engineering Decisions That Prevent Costly Respins

MosChip brings expertise Silicon design expertise spanning RTL design and verification, synthesis, DFT, physical design, and ...
Design And Reuse

Scaling Sandboxed Agentic AI on Xeon CPUs

Several sandboxing approaches are commonly used today, including virtual machines, containers, microVMs, and the open-source ...
Design And Reuse

QuickLogic Secures Six-Figure eFPGA IP Contract for Automotive Industrial SoC

QuickLogic's eFPGA Hard IP enables developers to incorporate programmable hardware functionality directly into their SoCs, allowing them to adapt algorithms, implement new features, accelerate ...
Design And Reuse

ElectraIC Launches the NEXUS N1 Series: A New Family of NVIDIA Jetson-Based AI Mini Supercomputers

ElectraIC proudly announces the launch of the NEXUS N1 Series, a new family of AI Mini Supercomputers designed to accelerate innovation in defense, aerospace, robotics, autonomous systems, machine ...
Design And Reuse

Faraday Powers Intelligent Sensing with New 14nm MIPI C/D Combo PHY IP

To address the growing demand for intelligent sensing, Faraday has expanded its MIPI C/D Combo PHY IP portfolio on UMC’s 14nm FinFET platform. The IP supports both MIPI C-PHY v2.0 at up to 3.0 Gsps ...
Design And Reuse

Lattice Semiconductor partners with Arm on AI server security

HILLSBORO, Ore. - Lattice Semiconductor (NASDAQ:LSCC) announced a collaboration with Arm to develop secure control and management solutions for AI infrastructure, according to a press release ...
Design And Reuse

Articron Challenges 1 Trillion KRW Valuation via Next-Gen Memory IP

Articron aims to scale its corporate valuation to over 1 trillion KRW by 2030 through next-generation artificial intelligence (AI) memory semiconductor intellectual property (IP). "Our target is to ...
Design And Reuse

Samsung Foundry to Manufacture Anthropic AI ASIC on 2 nm Node

Samsung Foundry may be on the verge of securing a significant deal with AI lab Anthropic to manufacture AI accelerators. According to the latest report, Anthropic is developing its custom AI ...
Design And Reuse

Chiplets at the Edge: How Modular SoCs Redefine Performance Per Watt

The evolution of edge systems is shifting the focus from computing power alone to how efficiently each watt is transformed into useful performance. Chiplets and modular system-on-chips (SoCs) enable ...
Design And Reuse

Is Your Android Product Development Built to Scale Beyond One Product?

When people talk about Android-based products, our minds just fetch the image of the latest smartphones, and yes, we all saw ...
Design And Reuse

GlobalFoundries reaches agreement to establish U.S.-based supply of silicon interposers for advanced AI packaging

GF expects to expand capacity at its Malta facility and establish the first U.S.-based source of silicon interposers supporting advanced packaging technologies, including embedded deep trench ...