Design And Reuse

intoPIX Titanium FPGA SoC EDK Achieves IPMX Certification

Louvain-La-Neuve, Belgium — intoPIX, the technology leader in low-latency video compression and AV-over-IP solutions, today ...
Design And Reuse

Achieving ISO 26262 ASIL-B Certification for Functional Safety, Chips&Media’s ‘WAVE6331X FuSa’ Video Codec IP Meets the Rigorous Safety Standards Required b…

Chips&Media (CEO Steve Kim, KOSDAQ: 094360), a leading global provider of multimedia intellectual property (IP), announced ...
Design And Reuse

Cadence Subsystem for PCIe 6.0 Architecture Achieves First-Pass PCI Express Specification Compliance

Cadence’s complete subsystem solution for PCIe 6.0 technology, including PHY and controller, is available now for SoC providers to design in. For more information on Cadence IP for PCIe 6.0 technology ...
Design And Reuse

QuickLogic Unveils Next-Generation eFPGA Hard IP for GlobalFoundries 12LP

QuickLogic is a Silver Sponsor of GlobalFoundries Technology Summit (GTS) North America. Attendees can meet with the QuickLogic team to learn more about the enhanced GF 12LP eFPGA Hard IP and ...
Design And Reuse

Multiple neuromorphic chips, one grid, no new middleware

The effect is that the arithmetic a layer performs tracks the number of events it generates, which is the count of ...
Design And Reuse

SEALSQ Subsidiary IC’Alps Advances QASIC Roadmap for Custom Quantum-Resistant ASICs

Post-quantum semiconductor and digital identity developer SEALSQ Corp (NASDAQ: LAES) has announced an engineering update on QASIC (Quantum-Resistant Application-Specific Integrated Circuit), its ...
Design And Reuse

NVMe 2.4 Update Adds Post-Quantum Security, Power Controls

As the non-volatile memory express (NVMe) protocol moves to an annual release cycle, the latest updates reflect the growing maturity of the ecosystem and the rapid pace of innovation driving its ...
Design And Reuse

Q2 Foundry Market Grows 29%... TSMC Dominates with 73% Share, Samsung Stuck at 7%

The global pure-play foundry market grew 29% year-over-year in the second quarter of this year, driven by surging demand for AI semiconductors. TSMC maintained its commanding lead with a 73% market ...
Design And Reuse

Arm Reveals AGI Server CPU Architecture at Hot Chips, Targeting Agentic AI Workloads

Arm detailed its AGI data center CPU at Hot Chips 2026, revealing a dual-chiplet design built on TSMC's N3P process with 64, 128, or 136 Neoverse V3 cores and a 300W TDP. Unlike AMD, Intel, and Nvidia ...
Design And Reuse

IBM and Arm: Expanding the Arm ecosystem for the next era of enterprise computing

By bringing Arm to future IBM Z and LinuxONE systems, IBM is connecting mission-critical enterprise computing with the software innovation powering modern cloud and AI infrastructure ...
Design And Reuse

Rapidus to receive $944m allocation from Japanese government for AI chip manufacturing

The company aims to boost domestic chip output and develop 2nm technology amid state-backed funding plans. By Anwesha Pattanaik, verdict.co.uk. Chip manufacturer Rapidus is to rec ...
Design And Reuse

Samsung Foundry begins full mass production of Nvidia's Groq 3 LPX chip

It was announced five months ago that Samsung Foundry had started making Groq 3 LPX chips for Nvidia. Now, Nvidia has announced that full-scale mass production of those chips has begun, giving Samsung ...