Design And Reuse

IC Manufacturing and Packaging: The Engine Powering the Digital and AI World

The modern world runs on integrated circuits (ICs). From smartphones and cars to AI data centers, medical equipment, ...
Design And Reuse

Infineon expands DRIVECORE portfolio with three new software bundles, accelerating customer transition toward future RISC‑V automotive microcontrollers

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its DRIVECORE software portfolio with three new bundles designed to simplify and accelerate software-defined vehicle (SDV) development. At ...
Design And Reuse

Samsung Ships Industry-First Commercial HBM4 With Ultimate Performance for AI Computing

Samsung Electronics, a global leader in advanced memory technology, today announced that it has begun mass production of its industry-leading HBM4 and has shipped commercial products to customers.
Design And Reuse

ST technologies integrated into Qualcomm’s new Snapdragon Wear Elite platform

STMicroelectronics has announced that its motion‑sensing and secure wireless components are now integrated into Qualcomm Technologies’ newly launched Snapdragon Wear Elite platform, designed for ...
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Keysight and Qualcomm Advance RF Digital Twins to Scale Massive MIMO and AI-Native 6G Research

Collaboration links digital twins with real-world measurements to reduce risk and speed development for 5G-advanced and emerging 6G networks . SANTA ROSA, Calif. -- Keysight Techn ...
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Rambus Sets New Benchmark for AI Memory Performance with Industry-Leading HBM4E Controller IP

Built on a proven track record of over one hundred HBM design wins to ensure first-time silicon success Delivers up to 16 Gigabits per second per pin at low latency to meet the demands of ...
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Keysight and Samsung Demonstrate End-to-End AI-RAN Validation Workflow with NVIDIA

Keysight Technologies, Inc. (NYSE: KEYS) and Samsung Electronics are collaborating to demonstrate an end-to-end Artificial Intelligence Radio Access Network (AI-RAN) testing and validation workflow ...
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DCD-SEMI to Showcase CAN XL with Functional Safety and RISC-V Subsystems at Embedded World 2026 – Booth 4-481

With less than a week remaining before Embedded World 2026 opens in Nuremberg, DCD-SEMI announces it will present its latest silicon-proven IP Core solutions at Booth 4-481, with a focus on CAN XL ...
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Jmem Tek Joins the Intel Foundry Accelerator Ecosystem Alliance Program, Enabling JPUF and Post-Quantum Security Designs

Jmem Tek announces that it has joined the Intel Foundry Accelerator Ecosystem Alliance as a partner in the IP and Chiplet Alliance programs. Through the Intel Foundry Ecosystem Alliance, Jmem Tek ...
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Renesas Expands Auto MCU Portfolio with 28nm RH850/U2C for Vehicle Control and Automotive Safety Applications

TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the RH850/U2C, a new 32-bit automotive microcontroller (MCU) built on ...
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QuickLogic Reports Fiscal Fourth Quarter and Full Year 2025 Financial Results

Total revenue from continuing operations for the fourth quarter of fiscal 2025 was $3.7 million, a decrease of 34.2% compared with the fourth quarter of 2024 and an increase of 84.0% compared with the ...
Design And Reuse

Working in electronics engineering

In this Agile Analog blog post for World Engineering Day I explain why I love working in electronics engineering, talk about our unique Composa technology and share some advice for young engineers ...