Design And Reuse

Samsung Electronics raises advanced foundry prices up to 15%, 4nm line at full capacity: Reuters

Samsung Electronics has raised prices for new orders on its advanced foundry processes by as much as 15%, with demand from Chinese customers proving particularly strong, according to sources cited by ...
Design And Reuse

Brite Semiconductor Releases 28nm High-Performance SAR ADC IP, Driving Upgrades for High-Speed Signal Chain Applications

As an iterative achievement of Brite Semiconductor in analog IP development, the newly‑released dual‑version SAR ADC IP demonstrates the company’s capabilities in area and power‑consumption ...
Design And Reuse

Andes Technology’s D23-SE RISC-V Processor Achieves ISO 26262 ASIL‑B and ASIL‑D Certification for Functional Safety Applications

Hsinchu Taiwan – Andes Technology, a leading supplier of high-efficiency, low-power RISC‑V processor IP solutions and Founding Premier member of RISC-V International, today announced that its ...
Design And Reuse

BOS Semiconductors Tapes Out Automotive AI Accelerator 'Eagle-N'... Begins Evaluation with German and Chinese Automakers

BOS Semiconductors, an automotive AI fabless company led by CEO Park Jae-hong—a former vice president of Samsung Electronics' System LSI and foundry divisions—has completed tape-out of its automotive ...
Design And Reuse

VeriSilicon's H1 revenue doubles but losses widen to 612 million yuan; monetizing billions in AI orders will take time

(688521.SS) delivered a half-year report marked by surging revenue and widening losses. According to its 2026 interim report disclosed on the evening of August 17, first-half revenue reached 1.864 ...
Design And Reuse

Ceva and Actions Show Off Strengths of Bluetooth HDT in New Audio Chips

Ceva and Actions Technology have announced the ATS296X-series Bluetooth audio SoCs, built on Ceva's Bluetooth High Data Throughput platform and among the first commercial implementations of a feature ...
Design And Reuse

Samsung reportedly considers converting R&D facility into 2nm HBM production line

Samsung Electronics is reportedly considering changing the role of a new semiconductor facility under construction in Giheung, South Korea, to support future demand for high-bandwidth memory (HBM) ...
Design And Reuse

Advanced Packaging Changes the Rules for Semiconductor Health and Performance Management

As infrastructure evolves from monolithic devices toward heterogeneous architectures, advanced packaging is becoming increasingly critical to achieving the required performance, bandwidth and power ...
Design And Reuse

SkyeChip's AI expansion to yield meaningful earnings from 2029

UOB Kay Hian said the initiatives could provide a second leg of growth for the semiconductor company from 2029 onwards. "In the meantime, SkyeChip's established silicon intellectual property (IP) and ...
Design And Reuse

StarFive Launches Server-Class RISC-V IP to Accelerate Its Strategic Expansion into AI Computing Infrastructure

StarFive officially launched 昉·天枢-100 (Dubhe-100), a RISC-V processor core designed for the server market. Purpose-built for high-performance computing, Dubhe-100 is designed to meet the rapidly ...
Design And Reuse

M31 Reports Nearly Fourfold Growth in Advanced-Node Royalties as Long-Term Investments Begin to Bear Fruit

M31 Technology Corporation (M31), a global leader in silicon intellectual property (IP), held its earnings conference today and announced consolidated revenue of NT$422 million for the second quarter ...
Design And Reuse

Socionext Broadens SoC Roadmap with Intel 18A-P Process Technology

By combining its ASIC expertise with Intel Foundry’s advanced process and packaging roadmap, Socionext will enable customers to create differentiated SoC solutions optimized for application- specific ...