AI chip design is now more connected to the system needs. The computer setup, memory structure, fast connections, ...

Chips&Media (CEO Steve Kim, KOSDAQ: 094360), a leading global provider of multimedia intellectual property (IP), announced ...

Louvain-La-Neuve, Belgium — intoPIX, the technology leader in low-latency video compression and AV-over-IP solutions, today announced that its Titanium FPGA SoC EDK has successfully completed IPMX ...

The effect is that the arithmetic a layer performs tracks the number of events it generates, which is the count of ...

Over the past five years, patent filings sitting directly at the intersection of AI and semiconductor increased by 114%, outpacing the broader combined sector’s 78% growth, according to Anaqua’s study ...

Since its global launch, the Eigen Engineering Agent has been adopted by more than 100 companies in 19 countries, including ANDRITZ Metals (Austria), CASMT (China) and Prism Systems (United States).

As the non-volatile memory express (NVMe) protocol moves to an annual release cycle, the latest updates reflect the growing maturity of the ecosystem and the rapid pace of innovation driving its ...

GlobalFoundries (Nasdaq: GFS) (GF) and RAAAM Memory Technologies, a pioneer in advanced on-chip memory solutions, today announced a strategic collaboration to develop and qualify Gain-Cell RAM (GCRAM) ...

ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced that Andes Technology, a leading supplier of RISC-V processor IP and a Founding Premier member ...

Flash Memory: For standard Matter end-devices, a memory range of 2 to 4 MB is required (a stack of the Matter SDK, device ...

But RF engineers have run into a different problem. As RF switches shrink, unwanted effects such as parasitic capacitance and contact resistance begin to dominate, and at advanced process nodes those ...