Design And Reuse

Sofics Extends Interface Voltage Options in TSMC FinFET and Nanosheet Technologies

Sofics has been a member of the TSMC Open Innovation Platform® (OIP) IP Alliance since 2010. Many fabless companies have successfully integrated Sofics IP into their designs on TSMC process nodes ...
Design And Reuse

Automated, Faster Specification to Sign-Off with IDS-AI

The other big news at DAC was the introduction of IDS-AI ™, our new agentic AI framework that automates your chip development ...
Design And Reuse

Overcoming power management IP challenges

To squeeze every drop of energy efficiency out of a modern chip, designers split the die into dozens of independent power domains. On paper, combining Dynamic Voltage and Frequency Scaling (DVFS), ...
Design And Reuse

BrainChip CEO Sean Hehir Talks Physical AI & Robotics with theCUBE at NYSE

BrainChip CEO Sean Hehir sat down with John Furrier for theCUBE + NYSE Wired’s Physical AI & Robotics series, filmed on the floor of the New York Stock Exchange. The conversation covers how ...
Design And Reuse

SemiWiki Article: Analog Bits Targets the Power Challenge at the Heart of Next-Generation Chips

We are honored to be featured in a recent SemiWiki article discussing our role in advanced semiconductor design with new intellectual property aimed at one of the industry’s most difficult problems: ...
Design And Reuse

SMART Photonics Partners with GlobalFoundries to Offer Industry’s First Open Access Foundry Service for Integrated Silicon and Indium Phosphide Photonics Products

SMART Photonics B.V. today announced its partnership with GlobalFoundries (GF) to offer a new open access foundry service combining GF’s scalable and production-proven silicon platform with SMART ...
Design And Reuse

Taiwan breaks ground on Kaohsiung advanced-packaging park anchored by TSMC

Taiwan has begun construction of a new industrial park in Kaohsiung that will devote part of its footprint to advanced semiconductor packaging equipment and suppliers, as the island expands capacity ...
Design And Reuse

Dnotitia Brings Dedicated Vector Silicon to Server Scale at AI Infra Summit 2026

VDPU integrates with Dnotitia's Seahorse vector database and widely used vector-search software including Milvus, FAISS and ...
Design And Reuse

Arm joins EuroCDP to accelerate Europe’s next generation of innovators

Europe has deep strengths in research, automotive, industrial technology and advanced engineering, and is also investing to strengthen its position across the semiconductor value chain. Under the ...
Design And Reuse

IC-Link by imec expands collaboration with TSMC to accelerate customer access to advanced-node chip design infrastructure and support

Through TSMC's OIP Cloud Alliance, the collaboration combines secure cloud-based design capabilities with access to advanced node technology and expert support to help innovators bring chips to market ...
Design And Reuse

M31 and Ambiq Collaborate on TSMC N12e® Foundation IP to Address Demanding SoC Power and Area Targets

M31 Technology (M31), a global silicon intellectual property (IP) provider, and Ambiq, a technology leader in ultra-low power semiconductor solutions for edge AI, today announced a joint ...
Design And Reuse

Siemens recognized as a Leader in Gartner Magic Quadrant for Global Industrial AIoT Platforms

Plano, Texas, USA -- Siemens announced today that it has been recognized as a Leader in the current Gartner® Magic Quadrant™ for Global AIoT Platforms 1 ­.