Design And Reuse

EXTOLL and Chip Interfaces introduce the Industry´s first Integrated UCIe IP Solution for GlobalFoundries FDX Technology

Mannheim, Germany -- EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, and Chip Interfaces, a leading supplier of digital IP cores are thrilled to offer the ...
Design And Reuse

Keysight to Showcase Spectrum Innovations at IMS 2026

What: At the 2026 IEEE MTT-S International Microwave Symposium (IMS), Keysight Technologies will showcase solutions that help engineers accelerate spectrum utilization by solving complex RF design, ...
Design And Reuse

Case Study: Completing CDC sign-off by linking static & dynamic verification – with Real Intent Meridian CDC

Completing Clock Domain Crossing Verification. Nvidia wanted a methodology for complete clock domain crossing verification ...
Design And Reuse

STMicroelectronics’ new GaN semiconductors improve energy efficiency for high-demand applications from AI servers to robotics

New gallium nitride (GaN)-based power semiconductors from STMicroelectronics are designed to improve efficiency and increase power density in high-demand applications that support electrification. The ...
Design And Reuse

Agnisys SystemRDL VS Code Extension: A Must-Have for Modern SystemRDL Development

This is exactly where the Agnisys SystemRDL VS Code Extension can really improve your productivity. Designed specifically for ...
Design And Reuse

MIPI Alliance Launches Compliance Program to Strengthen A-PHY Automotive Ecosystem

The MIPI Alliance, an international organization that develops specifications that standardize wired interfaces for mobile and other connected ecosystems, today announced the launch of the MIPI A-PHY ...
Design And Reuse

SkyeChip's World-First HBM4/HBM3E Combo PHY IP for SF4X Listed on Samsung Foundry CONNECT

SkyeChip Berhad today announced that its HBM4/HBM3E combo PHY IP has been officially listed on Samsung Foundry CONNECT, Samsung Foundry's IP ecosystem platform. As the world's first combined ...
Design And Reuse

Edge AI-Driven Matter Controller for Next-Generation Smart Homes

The smart home world is changing quickly. The Matter standard is reshaping how connected devices work together, and true ...
Design And Reuse

Siemens introduces new Simcenter PhysicsAI add-on for AI-powered CFD design exploration

Rapidly explore thousands of design variants in Simcenter STAR-CCM+ using AI-powered models that cut design exploration time from days to minutes; Predict geometry performance wit ...
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Fraunhofer IPMS Develops High-Density Chiplet Systems at the Wafer Level

As part of the European APECS pilot line, researchers at Fraunhofer Institute for Photonic Microsystems IPMS have developed a method that allows different chip components to be fused almost seamlessly ...
Design And Reuse

Three Audio Collaborations Tuning Up the Listening Experience

Three recent products from Lenovo, Kiwi Ears, and MH Acoustics highlight different approaches to improving how sound is captured and reproduced, whether that means making headset audio feel more ...
Design And Reuse

Quanta Computer selects Siemens Xcelerator to advance manufacturing innovation

Plano, Texas, USA - Siemens today announced that Quanta Computer Inc., a global leader in consumer electronics OEM/ODM manufacturing, is using the Siemens Xcelerator portfolio of industry software to ...