Qualcomm calls its sensing engine the Sensing Hub. Its 2024 whitepaper describes “an extremely efficient always-on AI ...

October 19, 2026 -- Tenstorrent, the AI computing company, has closed $1.5B in Series E funding at a $6.2B post-money valuation.

TSMC has announced plans to more than double its annual 2nm process production capacity by 2027 compared to this year. The company's 2nm revenue share reached 8% in Q3, up 5 percentage points from the ...

Intel CEO Lip-Bu Tan has defended the company's independence from the US government. Tan clarified that the US government's multibillion-dollar investment in the chipmaker does not give Washington ...

We’re thrilled to announce that our VP of Product Security and Innovation, Dr Axel Y Poschmann has been presented with the Test of Time Award at CHES 2026. The award is given yearly to honor a paper ...

GlobalFoundries has increased its capital investment in US semiconductor manufacturing facilities to $5 billion. This expansion is supported by an amended CHIPS Program award of up to $955 million.

October 16, 2026 – Weebit Nano Ltd ( ASX: WBT, Weebit or Company) provides this activity report for the quarter ended 30 September 2026 ( Q1 FY27 ), along with the Company’s Appendix 4C cash flow ...

Embedded memory, not compute, has become the limiting factor in AI and HPC SoCs, consuming more than half of total die area while constraining bandwidth, latency, and energy efficiency. As the ...

Chiplets are reshaping CPU design, enabling data centers to do more without increasing space or power consumption. By Christopher Tozzi,Technology Analyst, datacenterknowledge.com ...

Samsung is reportedly considering an acquisition in the silicon photonics space as it looks to close the gap with TSMC in advanced chip packaging. The technology could help Samsung meet growing demand ...

Most AI systems return an answer. Physical AI systems must return a motion: a steering correction, a robotic arm trajectory, or an emergency stop. The output is not a prediction on a screen. It is a ...

IBM and Siemens have announced a research collaboration to advance IBM’s 3D nanostack transistor architecture, targeting the design and manufacturing challenges of future angstrom-scale semiconductors ...