Design And Reuse

Asset Lifecycle Management at the Edge

By processing data at the edge, manufacturers can analyze asset behavior, detect issues faster, and act on insights much ...
Design And Reuse

Multi-Protocol Communication Systems Deliver a Richer User Experience

Consumer and industrial product builders see blossoming opportunity and are demanding multi-protocol options in support of ...
Design And Reuse

»Made in Germany« Security Chip Serves as a Root of Trust for Connected Devices

With the RISC-V Secure Element, the Fraunhofer Institutes for Integrated Circuits IIS, for Applied and Integrated Security AISEC, and for Electronic Microsystems and Solid State Technologies EMFT are ...
Design And Reuse

CAST Expands Functional Safety IP Line with ASIL B Ready SENT/SAE J2716 Receiver Core

The ASIL B Ready CSENT-RX receiver expands CAST’s line of Functional Safety IP cores for automotive and other safety-critical ...
Design And Reuse

High-Speed SerDes Design: Architecture, Equalization, and CDR Circuits

High-Speed Serializer/Deserializer (SerDes) technology addresses these challenges by enabling efficient communication over ...
Design And Reuse

INCIRT Announces Availability of Its PLL Series in the GlobalFoundries (GF) GlobalSolutions™ Ecosystem

INCIRT today announced that its general-purpose PLL Series is now available in the GlobalFoundries (GF) GlobalSolutions™ ecosystem IP Catalog. The series includes three ultra-low-jitter, low-power ...
Design And Reuse

Samsung Begins Mass Production of PM1763 SSD Optimized for Next-Generation AI Infrastructure

PCIe 6.0-based enterprise SSD delivers outstanding performance and enhanced power efficiency for AI and HPC servers; 9th-generation V-NAND, 4nm controller and liquid-cooling optim ...
Design And Reuse

Ceva Wins Landmark AI Licensing Deal with Major U.S. Software and AI Platform Company

NeuPro-M chosen as NPU IP foundation for custom AI silicon program, enabling OS-to-silicon optimization for next-generation intelligent computing devices ROCKVILLE, Md. — Ceva, Inc. (NASDAQ: CEVA), ...
Design And Reuse

Turning light into trusted data: how STMicroelectronics is reinventing Imaging for the AI era

STMicroelectronics’ Imaging subgroup (IMG) is at the heart of this shift, with a strategy built around depth sensing, AI-ready vision, and system-level integration. In this Q&A, Alexandre BALMEFREZOL, ...
Design And Reuse

Allegro DVT contributes to European automotive chiplet

An open chiplet standard backed by BMW and Bosch signals European ambition to reduce automotive chip dependency on single suppliers. automotiveworld.com. Allegro DVT has contribut ...
Design And Reuse

Imec extends auto chiplet program to edge computing

Imec is extending the lessons learnt in its Automotive Chiplet Program to an Autonomous Edge Chiplet Program (AECP) as an acknowledgment that the same foundational HPC building blocks can serve a ...
Design And Reuse

MIPS on the RISC-V Shift: ‘Physical AI Is Agentic AI at the Edge’

MIPS, by GlobalFoundries, CEO Sameer Wasson and CTO Yankin Tanurhan sit down with EE Times Nitin Dahad to discuss the recent acquisition of the Synopsys IP Processor Solutions business and the ...