Design And Reuse

EXTOLL announces Availability of Industry´s first 16G UCIe PHY IP in GlobalFoundries 22FDX/22FDX+ Ready for Customer Integration

EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, announces the availability and readiness for customer integration of the industry´s first 16G UCIe PHY IP ...
Design And Reuse

Aeva Adopts Cadence Tensilica Vision DSP to Advance Lidar Performance and Efficiency

Cadence (Nasdaq: CDNS) today announced that Aeva, a leader in next-generation sensing and perception systems, has licensed Cadence ® Tensilica ® Vision DSP IP to accelerate signal processing in its 4D ...
Design And Reuse

Chips&Media Completes Development of Next-Gen 'AV2' HW Decoder IP

HW RTL release in May with active commercial licensing talks underway with major North American clients ...
Design And Reuse

SEMIFIVE and ICY Tech Achieve Successful Tape-out of 8nm eMRAM-Based Edge AI SoC, Targeting First Commercialization in Asia

This collaboration represents SEMIFIVE's first ASIC design project leveraging eMRAM technology. By integrating eMRAM into an Edge AI accelerator, the company aims to reinforce its technical leadership ...
Design And Reuse

Malaysia launches advanced semiconductor packaging push to climb global value chain

Malaysia has launched an ambitious national initiative to develop domestic capability in advanced semiconductor packaging within the next two years, marking a strategic move to move further up the ...
Design And Reuse

GlobalFoundries Outlines Long-Term Growth Roadmap and Announces First-Ever Dividend at 2026 Investor Day

Today at its 2026 Investor Day, GlobalFoundries (NASDAQ: GFS) highlighted clear opportunities for durable growth in AI-centric markets, expanding profitability and long-term value creation, ...
Design And Reuse

Sony Semiconductor Solutions and TSMC Enter Preliminary Agreement for Next-Generation Image Sensor Strategic Partnership

Sony Semiconductor Solutions Corporation (“Sony”) and TSMC (TWSE: 2330, NYSE: TSM) today announced the signing of a non-binding memorandum of understanding (“MOU”) to form a strategic partnership for ...
Design And Reuse

A Systematic Approach to Robust LVDS Integration in Advanced Node ASICs

In practice, projects rarely fail because a high-speed core fails in isolation; they fail when foundational I/O interfaces—such as LVDS—are taken for granted and become vulnerable to the parasitic ...
Design And Reuse

After GPUs, CPUs Take Center Stage as Intel Rally Lifts KOSDAQ Stocks

CPU Demand Surges on 'Edge AI' Expansion; Intel Up 114%, AMD 65% in a Month ; Related KOSDAQ Suppliers Like Interplex Soar; By Yoon Min-hyuk, sedaily.com. The semiconductor bottle ...
Design And Reuse

Nvidia Enters the Scene. Behind the $400 Million in Financing, RISC-V Ushered in Spring

On April 9, 2026, SiFive announced the completion of a $400 million oversubscribed Series G financing, and NVIDIA appeared on the list of investors. What's more notable is not the financing amount, ...
Design And Reuse

HighTec EDV-Systeme and SiFive: Together strengthening the RISC-V Ecosystem for Safe and Secure Automotive and Industrial Applications

SiFive, a leading supplier of high-performance RISC-V processor IP, is collaborating with HighTec EDV-Systeme, a leading provider of automotive compiler solutions, to accelerate safety-ready RISC-V ...
Design And Reuse

Renesas Completes Acquisition of Irida Labs to Expand Vision AI Software Capabilities and Accelerates System-Level Vision Solutions

Renesas Electronics Corporation (TSE:6723, “Renesas”), a premier supplier of advanced semiconductor solutions, today announced that a subsidiary of Renesas has completed the acquisition of Irida Labs, ...