Design-Reuse

Samsung resumes 1.4nm chip development, targets 2029 mass production

Samsung Foundry, one of the world’s most advanced semiconductor chip manufacturers, faced yield-related issues over the past few years. To focus on resolving those problems, the company took a step ...
Design-Reuse

Perforce Intelligence Advances Control and Trust for AI Workflows

Perforce Agentic Gateway provides an orchestration layer for the AI-Driven Development Lifecycle (AI-DLC) to control token consumption and ensure compliance across MCPs. As enterprises move from AI ...
Design And Reuse

Building the Digital Cockpit: From Hardware to AI

In this context, the digital cockpit has become the primary human–machine interface (HMI), integrating instrument clusters, ...
Design And Reuse

CAST Introduces PSI5-HOST IP Core for Automotive Sensor Interfaces

Semiconductor intellectual property provider CAST today announced the PSI5-HOST Peripheral Sensor Interface 5 Host Controller ...
Design And Reuse

Chips&Media Signs APV codec IP Licensing Deal with North American Big Tech, Establishing the ‘Second Front’ Against Apple’s ProRes

P’ confirmed for flagship devices of a major North American client Following the Samsung-Qualcomm alliance, Chips&Media and North American Big Tech solidify APV as the industry standard Targeting the ...
Design And Reuse

Synopsys Debuts ESUN IP for Breaking AI ‘Slowest Packet’ Bottleneck

Launched today, Synopsys’ ESUN IP solution slashes AI tail latency and eliminates networking bottlenecks to enable seamless, scalable performance for modern AI infrastructure. b ...
Design And Reuse

StarFive and LECARC Forge Partnership to Co-Develop RISC-V Server CPUs and Seize New Opportunities in the Agentic AI Era

StarFive, a leading provider of RISC-V architecture IP and solutions, and Theo End Computing(LECARC), a cloud computing CPU chip and solutions provider, officially announced a strategic partnership.
Design And Reuse

Advancing UCIe Performance: Enabling 40G for Next-Generation Multi-Die Designs

As multi-die designs continue to scale across AI and high-performance computing (HPC), the demand for higher bandwidth, tighter integration, and predictable system-level performance has never been ...
Design And Reuse

BrainChip Announces Commercial Availability and Production Shipments of AKD1500 Neuromorphic Processors

Manufactured in partnership with GlobalFoundries (GF) using their advanced 22nm Fully Depleted Silicon-on-Insulator (22FDX®) technology, the production-ready AKD1500 delivers highly efficient, ...
Design And Reuse

Samsung Unveils AI Foundry Ecosystem Push

The artificial intelligence (AI) semiconductor competition is expanding into an ecosystem competition that encompasses not only advanced processes but also design, IP, and packaging. This is the ...
Design And Reuse

Wave Photonics Announces Synopsys OptoCompiler Compatibility for PDKs hosted on its PDK Management Platform

Wave Photonics announced that, as of today, all the PDKs developed or managed by Wave Photonics through the PDK management platform are now compatible with Synopsys OptoCompiler. OptoCompiler is the ...