PentaG-NTN modem IP subsystem, aimed at satellite user terminals supporting low Earth orbit (LEO) and medium Earth orbit (MEO) constellations, at MWC 2026. The soft IP is set to simplify the ...

Microchip recently expanded its dsPIC33A digital signal controller lineup with the dsPIC33AK256MPS306 family of digital signal controllers (DSCs), which target applications that require fast, ...

Europe is taking a more structured approach to turning quantum research into hardware that can be manufactured at scale, with Infineon positioning itself as one of the industrial players helping that ...

TSMC outlined its manufacturing technology roadmap through 2029 at its North American Technology Symposium 2026. According to Tom’s Hardware, the company introduced its 1.2nm- and 1.3nm-class ...

Atomera’s quantum-engineered MST® films and Synopsys’ TCAD simulation combine to accelerate next-generation GaN device development for RF and power electronics LOS GATOS, Calif.-- Atomera Incorporated ...

eUSB2V2 on N2P was developed with co-optimization across design, circuit implementation, and physical layout. The goal was to improve performance and power efficiency, while also addressing area ...

As AI workloads continue to diversify, the systems that support them are evolving just as quickly. AI is no longer confined to the hyperscale data center. It is moving to the factory floor, into ...

EU DARE project explores alternatives after Codasip divestment creates uncertainty around roadmap and architectural direction. By Pablo Valerio, EE Times. The European High-Perfor ...

Modern SoC Evaluation Boards demand high-performance design, SI/PI, and system validation. Faraday offers 3 flexible service levels to meet these complexities.

Silvaco Group, Inc. (Nasdaq: SVCO, "Silvaco"), a provider of TCAD, EDA software, and SIP solutions that enable semiconductor design and digital twin modeling through AI software and innovation, today ...

LPDDR-based SOCAMM2 chipset, including new Voltage Regulators and SPD Hub, supports AI data center performance scaling in a low-power, high-bandwidth, compact module form factor First in a planned ...

Whilst chiplets garner much interest, many remain cautious about adopting multi-die solutions because the technology transition affects far more than just packaging; it changes the approach to design ...