Cadence (Nasdaq: CDNS) today announced an expanded collaboration with Intel Foundry to advance Design Technology Co-Optimization (DTCO) targeting Intel’s next-generation process technologies, ...

SEOUL, Korea – Chips&Media (KOSDAQ: 094360), a leading global provider of video intellectual property (IP), announced today that it has licensed its latest-generation video codec IP to Ambarella ...

INNOSILICON Technology today officially announced the launch of its comprehensive high-speed UALink (Ultra Accelerator Link) solution portfolio, featuring industry-leading single-lane 112G/224G ...

Antipolis, France — Presto Engineering Group, a global leader in application-specific integrated circuit (ASIC) supply and semiconductor services, and Menta, a pioneer and recognized leader in ...

BRIDGEWATER, N.J. -- The MIPI Alliance, an international organization that develops specifications that standardize wired interfaces for mobile and other connected ecosystems, today announced the ...

Intel says that AI doesn't scale as a collection of parts, but rather as it scales as a coordinated system. The CPU remains the control plane for the modern AI infrastructure, says the company. With ...

EMI shielding — using conductive materials to block unwanted electromagnetic interference — is often where the problem starts, and where the fix lives. Over hundreds of enclosure shielding projects, ...

NVIDIA and TSMC are expanding their long-running partnership by bringing AI and accelerated computing directly into semiconductor manufacturing, targeting faster chip production, improved yields and ...

Intel Corp regards Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) as a longstanding partner, as the US chipmaker would continue outsourcing production of advanced chips to TSMC, Intel chief ...

Regionally, year-to-year sales in April were up in the Americas (115.8%), Asia Pacific/All Other (114.9%), China (78.6%), Europe (54.7%), and Japan (15.6%). Month-to-month sales increased in the ...

Earlier this year, Rapidus announced that it received a 100 billion yen investment from the IPA, in addition to private-sector funding, totaling 167.6 billion yen from 32 companies including Canon, ...

T2M will be at MWC Shanghai 2026 to discuss its portfolio of silicon-proven Cellular and SatCom IP cores with semiconductor companies developing next-generation SoCs for IoT, Industrial, Automotive, ...