Design And Reuse

Matter Certification Checklist for OEMs

Flash Memory: For standard Matter end-devices, a memory range of 2 to 4 MB is required (a stack of the Matter SDK, device ...
Design And Reuse

A scalable, shader-programmable vector graphics GPU core for low-power MCUs

By TES Electronic Solutions, with appreciated help from ChatGPT5.6, and Gemma4:31b ...
Design And Reuse

Powering the next architecture shift: Inside GF’s approach to 48V

Engineers across automotive, industrial and AI infrastructure are increasingly adding 48V distribution alongside traditional ...
Design And Reuse

Synopsys Posts Financial Results for Third Quarter Fiscal Year 2026

SUNNYVALE, Calif. -- Synopsys, Inc. (Nasdaq: SNPS) today reported results for its third quarter of fiscal year 2026. Revenue for the third quarter of fiscal year 2026 was $2.477 billion, compared to ...
Design And Reuse

RISC-V extensions for high performance embedded computing

One of the key advantages and challenges of the RISC-V architecture is the ability to add custom instructions. Adding instructions to a RISC-V core can make a system more secure or boost performance ...
Design And Reuse

AI is changing security testing, but not all vulnerabilities are created equal

Artificial intelligence is rapidly reshaping cybersecurity. Much of the conversation has focused on how large language models are helping developers write code, but a more significant shift may be ...
Design And Reuse

Navigating ISO 26262 Part 11: A Guide for Semiconductor Architects

ISO 26262 Part 11 provides semiconductor-specific guidance to help architects make those decisions, while showing how modern SoC architecture and automation can reduce development risk. ISO 26262 Part ...
Design And Reuse

UMC Shares Climb 6% on AI Foundry Investment Defying Market’s Semiconductor Downturn

HSINCHU, Taiwan – United Microelectronics Corp (UMC) shares rose 6% after the company maintained its confidence in its AI foundry strategy despite a wider sector selloff affecting semiconductor stocks ...
Design And Reuse

Stop Treating Fanout RDL Like Substrate Routing

Fanout RDL routing must support tighter design margins compared to package substrate routing. Substrate routing distributes signals over larger geometries, longer paths, and many layers. Fanout RDL ...
Design And Reuse

Korea's AI ambition faces power crunch

Korea’s ambition to develop next-generation semiconductors, physical artificial intelligence (AI) and data centers is running into a basic but formidable constraint: electricity.
Design And Reuse

Hardware security verification must go beyond functional testing

Imagine you’re an attacker staring at a billion-transistor system-on-chip (SoC). You don’t care whether the design boots Linux, passes simulation, or meets its performance targets. Your objective is ...
Design And Reuse

Integrated Photonics for Wireless Applications: Enabling Free-Space Optics, 6G, and Beyond

PICs are unlocking faster wireless technologies like FSO, 6G, and ISAC, with real solutions already emerging for today’s biggest challenges. Wireless networks are under growing pressure to support ...