Design And Reuse

Embedded SoC Design Mistakes Startups Must Avoid

The race to build innovative semiconductor products is accelerating as startups enter markets such as Artificial Intelligence ...
Design And Reuse

China Develops Its First 3.5D "Infinity Chiplet" & 3D DRAM Tech As It Tackles External HBM Constraints Through Domestic AI Supply Chain

China's DFSX is working on fueling its domestic AI supply chain with next-gen 3.5D "Infinity Chiplet" architectures & 3D DRAM technologies. DFSX Is Working on China's First DF1000 AI Accelerator With ...
Design And Reuse

SILITH and UMC Achieve Mass Production Milestone for Silicon Photonics

Accelerating High-Volume Silicon Photonics Manufacturing for AI Infrastructure. UMC delivers first mass-produced silicon photonics wafers from UMC’s Singapore 12-inch fab, marki ...
Design And Reuse

From complexity to simplicity: Scaling and future-proofing chiplets with AMBA®︎ CHI C2C property negotiation

In this blog post, we introduce the Property Negotiation Learn the Architecture guide and Issue B of the AMBA CHI C2C specification, which we recently published. Chiplets are changing how custom ...
Design And Reuse

Intel Resolves 18A Yield Variability; A Storm to Engulf Samsung and TSMC?

The U.S.-based Intel, which had been subjected to harsh criticism for issuing ‘empty promises’ while struggling immensely to secure yield in micro-fabrication processes, has reportedly finally ...
Design And Reuse

Analog Bits Expands Global Engineering Footprint with New Design Center in Dongtan, South Korea

Strategic investment strengthens worldwide engineering capabilities and accelerates innovation to support growing need for smarter and more efficient analog and power solutions for advanced ...
Design And Reuse

Running multiple AI agents on one repo? You’ve probably hit the merge wall.

For semiconductor design teams coordinating RTL, firmware, and verification with multiple AI-assisted contributors, that ...
Design-Reuse

Tesla-Samsung AI5 Chip Hits Tape-Out at Taylor Fab on 2nm Process

A Samsung Foundry engineer has publicly corroborated that the Tesla-Samsung AI5 chip has reached tape-out, marking the completion of its design phase and clearing the runway for manufacturing at ...
Design And Reuse

Asset Lifecycle Management at the Edge

By processing data at the edge, manufacturers can analyze asset behavior, detect issues faster, and act on insights much ...
Design And Reuse

Enabling Next-Generation Data Center Infrastructure for Agentic AI: Introducing the Rambus DDR5 9600 Server RDIMM Chipset

As artificial intelligence workloads evolve from model training to real-time inference and autonomous agentic workflows, the demands placed on system memory continue to rise rapidly. The modern data ...
Design And Reuse

Multi-Protocol Communication Systems Deliver a Richer User Experience

Consumer and industrial product builders see blossoming opportunity and are demanding multi-protocol options in support of ...
Design And Reuse

The Dawn of Agentic AI Super-Agents

On the other hand, I sometimes find it hard to restrain myself from exclaiming, “Wow!” or “You must be joking!” Before we plunge headfirst into the topic of Agentic AI Super-Agents, however, I feel ...