Design And Reuse

Cadence OrCAD Xplore Design Platform Unifies Design, Component Intelligence and Procurement to Accelerate Electronics System Development

Unifies schematic design, component discovery, expertise and procurement in Cadence OrCAD Xplore Design Platform, reducing time-consuming component research from hours to minutes. Provides trusted ...
Design And Reuse

M31 Lands First Angstrom‑Node Licensing Deal; North America Revenue Doubles, Royalties Hit a 15‑Quarter High

In addition, M31 once again received TSMC’s “Partner of the Year” award for consumer and mobile Specialty Process IP this year, marking the 9 th consecutive year the Company has earned this ...
Design And Reuse

Andes Technology Introduces Next-Generation Andes Automated Custom Extension to Simplify Domain-Specific RISC-V Processor Innovation

HSINCHU, Taiwan – Andes Technology (TWSE: 6533), the leading supplier of high-performance, low-power 32-bit and 64-bit RISC-V processor IP and a Founding Premier member of RISC-V International, today ...
Design And Reuse

Qualitas Semiconductor to Showcase Interconnect Solutions for the AI and Chiplet Era at ICCAD Expo 2026 in China

SEOUL, South Korea – QUALITAS SEMICONDUCTOR CO., LTD. (hereinafter referred to as "Qualitas") (KOSDAQ: 432720), a leading provider of high-speed interface IP solutions, announced that it will ...
Design And Reuse

Arteris Announces Financial Results for the Third Quarter and Estimated Fourth Quarter and Updated Full Year 2026 Guidance

CAMPBELL, Calif. -- Arteris, Inc. (Nasdaq: AIP), a leading provider of semiconductor technology for accelerating innovation in the AI era, today announced financial results for the third quarter ended ...
Design And Reuse

Nuclei Releases the NI1000 Series General-Purpose Compute Core with Support for the VME Matrix Extension

Shanghai, China – Nuclei, a leading provider of high-performance semiconductor IP processing solutions, today introduced the ...
Design And Reuse

Infineon’s RISC-V AURIX platform is a major win for MIPS and GlobalFoundries

Infineon's next-generation automotive microcontroller platform uses MIPS processor IP, raising questions about the future of TriCore. By David Harold, jonpeddie.com ...
Design And Reuse

What Is the Intel 14A PDK 0.9, and Why Does It Matter to Foundry Customers?

The Intel 14A process design kit (PDK) 0.9 gives foundry customers a more mature, silicon-validated environment for designing products on the Intel 14A process node. This milestone is an important ...
Design And Reuse

Fraunhofer IPMS advances chiplet integration and low-power memory

Fraunhofer IPMS will showcase new semiconductor technologies at SEMICON Europa 2026 in Munich, highlighting advances in chiplet integration, photonics and energy-efficient memory. The developments aim ...
Design And Reuse

Greece opens consultation on National Strategy for Semiconductors and Microelectronics

Greece is preparing a new national framework to strengthen its semiconductor and microelectronics industry. The Ministry of Development is opening a public consultation on its proposed National ...
Design And Reuse

FD-SOI, challenging 7nm, what makes it possible?

Eight years ago, GlobalFoundries announced that it would stop the R&D of 7nm FinFET process. Eight years later, this wafer foundry is trying to re-enter the competition of advanced logic processes ...
Design And Reuse

Q&A: What Real-World Projects Reveal About Multi-Die Design

To meet those requirements, companies are increasingly turning to multi-die designs with advanced packaging. Farhang Yazdani, CEO of BroadPak and a longtime leader in advanced semiconductor packaging, ...