The semiconductor industry is in the midst of a paradigm shift, driven by the insatiable demand for artificial intelligence (AI) and high-performance computing (HPC). At the heart of this ...

Sofics has been a member of the TSMC Open Innovation Platform® (OIP) IP Alliance since 2010. Many fabless companies have successfully integrated Sofics IP into their designs on TSMC process nodes ...

SMART Photonics B.V. today announced its partnership with GlobalFoundries (GF) to offer a new open access foundry service combining GF’s scalable and production-proven silicon platform with SMART ...

Taiwan has begun construction of a new industrial park in Kaohsiung that will devote part of its footprint to advanced semiconductor packaging equipment and suppliers, as the island expands capacity ...

M31 Technology (M31), a global silicon intellectual property (IP) provider, and Ambiq, a technology leader in ultra-low power semiconductor solutions for edge AI, today announced a joint ...

BrainChip CEO Sean Hehir sat down with John Furrier for theCUBE + NYSE Wired’s Physical AI & Robotics series, filmed on the floor of the New York Stock Exchange. The conversation covers how ...

We are honored to be featured in a recent SemiWiki article discussing our role in advanced semiconductor design with new intellectual property aimed at one of the industry’s most difficult problems: ...

Through TSMC's OIP Cloud Alliance, the collaboration combines secure cloud-based design capabilities with access to advanced node technology and expert support to help innovators bring chips to market ...

BOS Semiconductors is pleased to share a recent interview with Dr. Jaehong Park, CEO of BOS Semiconductors, featured by ZER01NE, Hyundai Motor Group’s open innovation platform.

Europe has deep strengths in research, automotive, industrial technology and advanced engineering, and is also investing to strengthen its position across the semiconductor value chain. Under the ...

Plano, Texas, USA -- Siemens announced today that it has been recognized as a Leader in the current Gartner® Magic Quadrant™ for Global AIoT Platforms 1 ­.

Siemens today announced continued collaboration with TSMC to drive innovation in AI-powered automation and advanced semiconductor design enablement. Building on a longstanding relationship within the ...