The specification is backward compatible with UniPro v2.0.

(NASDAQ: SNPS) today announced the appointment of Peter A. Shimer to its board of directors. Shimer brings four decades of experience at international public accounting firm Deloitte where he held ...

Baya Systems, a pioneer in software-driven, chiplet-ready semiconductor fabric IP for scalable AI, high-performance computing (HPC), and automotive applications, today announced a partnership with ...

VerveSemi Microelectronics Secures $10M Series A to Accelerate Global Semiconductor Footprint What is the news?

Seoul, South Korea – SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, announced today that it has secured a design win from Niobium, a U.S.-based leader in Fully ...

The MIPI M-PHY v5.0 IP introduced by M31 strictly complies with MIPI Alliance specifications and delivers per-lane data rates of up to 23.32Gbps in HS-G5 (High Speed Gear 5) mode—doubling the ...

UET-TSS-IP-369, an inline, high-performance, multi-channel packet engine that provides a complete TSS layer at rates up to 1.6Tbps. It embeds the UET-TSS-IP-69 as processing data path and complements ...

sensiBel’s SBM100B is a fusion of high-precision technologies, all orchestrated to elevate sound capture to unprecedented levels of accuracy. By leveraging Sofics’ silicon-proven ESD IP, sensiBel also ...

Data center digital twins are transforming data center design from assumption-based planning to physics-backed simulation—well before the first rack is deployed. By combining physics simulations with ...

Siemens has won in the “Packaging: Design” category at the 2026 Chiplet Summit Best of Show Awards for its Innovator3D IC™ solution. The solution provides a fast, predictable pathfinding, planning and ...

Modern AI workloads demand new operators, execution patterns, precision formats, and data-movement behaviors. Supporting them requires coordinated changes across instruction sets, microarchitectures, ...

Compartmentalisation is a modern security approach where software is divided into small, well-bounded modules, and each ...