Japan's Panasonic has raised PCB material prices for the second time in 2026, broadening the increases to copper-clad ...

The US is rapidly reshaping the cost structure of its solar supply chain under Section 232 of the Trade Expansion Act of 1962 ...

Apple has unveiled new Mac mini and Mac Studio models, equipped respectively with its first 2-nanometer chip, the M6, and the ...

Industry players say Taiwan's push to localize semiconductor materials did not begin in 2026. The real turning point came in ...

Micro LED maker PlayNitride Inc. expects the technology to enter commercial optical communications applications within two ...

On the eve of the official opening of SEMICON Taiwan 2026, the SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA), initiated ...

Interested in knowing how to solve the microcrack problem in through-glass via (TGV) fabrication? Interested in knowing how ...

Millimeter-wave phased-array solutions provider Tmytek is set to list on the Innovation Board in September. Although the ...

As AI, high-performance computing (HPC), and advanced packaging continue to move toward higher levels of power integration, ...

Gudeng Precision Industrial chairman Bill Chiu said on August 31 that the company has begun building out its global ...

LG Electronics is bolstering sales of home appliances, TVs and other consumer products through innovation and product ...

The competition in high-bandwidth memory (HBM) is moving beyond DRAM stack height, bandwidth, and packaging to the base die ...