As demand for AI computing expands across industries and applications, chipmakers are seeking opportunities beyond ...

Samsung Electronics said on November 12 it had moved up the planned opening of its new high-bandwidth memory (HBM) packaging ...

DIGITIMES Insight: Entering glass substrate era, core layers are no longer an exclusive process for substrate makers ...

At the opening panel of electronica 2026 in Munich on November 10, industry leaders agreed that the primary bottleneck in ...

Taiwan-based Ta Liang Technology, a printed circuit board (PCB) equipment manufacturer, said its order visibility for PCB and ...

Taiwan’s glass fiber exports to South Korea rose 54.0% year-over-year in the first nine months of 2026 as demand for ...

China is advancing its domestic semiconductor ambitions while continuing to access restricted US AI processors, exposing the ...

DB HiTek's third-quarter 2026 results point to continued strength in its core foundry operations, even as a steep decline in ...

Industrial computer (IPC) maker DFI reported higher revenue and profit in the third quarter of 2026, with earnings per share ...

The award ceremony for the fourth K. T. Li Award was held in Taipei on November 10, with this year's awards presented by ...

A semiconductor chip no thicker than a fraction of a human hair might seem insignificant beside the powerful silicon ...

Mitsubishi Gas Chemical (MGC) announced on November 10 that it will expand manufacturing and shipment-inspection equipment at ...