China is broadening its advanced packaging base as restrictions on leading-edge semiconductor equipment complicate further ...

Samsung Electronics has reportedly begun trial production of Tesla's next-generation AI5 processor at its Taylor foundry in ...

Apple is exploring a return to the enterprise server market with an AI inference system built around future M8 Ultra chips, ...

Taiwan has demonstrated its strong R&D and innovative capabilities in tech, but the challenge remains in propelling these ...

Huawei has unveiled its next-generation Ascend 960 supernode, positioning near-packaged optics (NPO) at the centre of its ...

SK Hynix is keeping its US memory options open as customers move earlier to secure 2027 supply, with tightening availability ...

Huawei expects autonomous AI agents to become the dominant source of AI traffic over the next decade, creating a sharp ...

Apple's iPhone 18 Pro and Pro Max are emerging as the main drivers of Taiwan's premium smartphone upgrade cycle, with ...

Foxconn Industrial Internet (FII) chairman Brand Cheng said Foxconn is integrating four core capabilities — technology, ...

Taiwan will launch a pilot emissions trading scheme (ETS) by the end of 2026 to help semiconductor and technology ...

The EU's Packaging and Packaging Waste Regulation (PPWR, Regulation (EU) 2025/40) has been in force since Aug. 12, 2026, ...

Taiwan is developing an emissions trading scheme (ETS) alongside its carbon fee system, with the Ministry of Environment ...