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University of Birmingham spin-out KVector has raised £3.8 million to commercialise a low-power alternative to electronically ...

David Lockwood, the former CEO of Babcock International Group and President of ADS Group Limited, has been appointed Knight in the Order of the Legion of Honour in France. This is by decree of the ...

The European Space Agency (ESA) and Axiom Space have signed a memorandum of understanding (MoU) for a post-International Space Station ecosystem.

This may be of interest: Wiley has introduced a new Artificial Intelligence (AI) zyBook for students to learn how to build AI ...

Initially conceived to address overcharging, high temperatures and deep discharge, battery management systems have evolved into intelligent and sophisticated systems for battery-powered systems, ...

The chip market continues with treble-digit monthly annualised value growth rates, twice as large as the industry’s two previous record highs in June 2000 (59.3%) and January 2010 (66.6%). Prior to ...

The snowball effect from higher NAND and DRAM prices has raised smaller component prices, like capacitors, PCB boards, power delivery components, and more. Beyond conventional computers, consoles, and ...

According to imec’s latest logic technology roadmap, High NA EUV lithography insertion is anticipated for the A14/A10 logic node, where achieving reliable patterning at aggressive pitches is critical.

In August Morgan Stanley reckoned Google could pull $84/108 billion in chip-related cloud revenues in 2027/28. Which explains why Google is unworried by its $200 billion datacentre capex this year.

SWISSto12 and Mitsubishi Electric (MELCO) have signed an MoU to use MELCO’s satellite system expertise and SWISSto12’s 3D-printing processes to develop small, light payloads built in short timeframes.

The circular industrial connector specialist binder binder is expanding its M12 portfolio with angled panel-mount connectors. For centric PCB mounting, they are designed to fit into a slim, ...