Design, simulation and manufacturing advances continue to push photonic integrated circuits (PICs) to smaller sizes, which provide greater capabilities per chip, writes Liam Critchley.
Cooling is one of the clearest illustration of how semiconductor design teams need to work together. There is a running joke in engineering circles that the last time an electrical engineer saw a ...
Cerebras takes the view that fast-results generation is the key competitive denominator. A Cerebras WSE can store all of the ...
Xiaomi’s Q2 profit of $923 million was nearly half that of Q2 2025, as the smartphone vendor and EV manufacturer was hit by the double whammy of rising component costs and falling demand. Xiaomi ...
Velaura AI, focussed on energy-efficient computing infrastructure and physical AI, has raised $110 million in Series A ...
ECTC 2027 will take place June 1-4, 2027at the Gaylord Rockies Resort & Convention Center in Denver, CO. More than 2,500 ...
As of June 30, support for Ukraine over the last four and a half years totalled $133 billion from the USA and $110 billion from EU countries says the Ukraine Support Tracker at th ...
Microchip Technology has released Revision 2.0 of its PolarFire FPGA Ethernet Sensor Bridge. This is a smaller, ...
As of early August, cruise lines on the Danube, the Rhine and the Main are still disrupted, with itineraries being adjusted or canceled outright. Critical energy infrastructure, agriculture and food ...
Neuromorphic chips run event-driven spiking neural networks (SNNs), where each neuron lets incoming input accumulate. When ...
The event will also examine optimising Edge AI for next-generation applications, whether for remote, hostile environments or ...
Nvidia is reported to have booked TSMC A16 capacity for Feynman, its post-Rubin architecture GPU. A16 is TSMC’s 1.6nm successor to its 2nm process N2 with GAA transistors and backside power delivery.
Some results have been hidden because they may be inaccessible to you
Show inaccessible results