This morning Huawei announced it will have a 1.4nm equivalent density process in place by 2031 – only three years behind TSMC – without using EUV. At the 2026 IEEE International Symposium on Circuits ...
The name of the tech game for the last few years has been how to prise a slice of the action out of the grip of Nvidia, OpenAI, Anthropic, the hyperscalers, Microsoft et al, Ed confides to his diary.
Swiss and French microrobots walked away with gold at the 2010 IEEE International Conference on Robotics and Automation in Alaska. In the Mobile Microrobotics Challenge, six teams from Canada, Europe ...
Callosum, a Cambridge University spinout, is looking to raise $100 million to develop software to allow AI programmes to perform better by running on multiple processor architectures. ‘New chips and ...
Looking only at those articles written in the last week, the most read stories cover BrainChip, the neuromorphic AI IP specialist, Kioxia forecasting profits, and Google and Blackstone forming a ...
David Manners has more than forty-years experience writing about the electronics industry, its major trends and leading ...
Semtech, the IoT specialist, is joining the Z-Wave Alliance as a new member and will serve on the standard body’s Board of ...
Three year-old startup Decart of San Francisco has raised $300 million to develop software which allows AI programmes to run ...
BrainChip sells semiconductor IP and SoC designs specifically engineered for NK applications. By integrating the expertise of ...
Blackstone, a private equity company, and Google are forming a neo-cloud company to acquire, build and rent out datacentre capacity. The initial investment is $5bn in equity from Blackstone and $20bn ...
It said capacity increases for 2nm and A16 wafers will grow at a 70% CAGR from 2026 to 2028, and that CoWoS capacity will grow at more than 80% CAGR from 2022 to 2027. The company also plans to build ...
SEMI has written a letter to the US Congress asking for an extension of the Advanced Manufacturing Investment Credit (AMIC).