Rapidus, the Japanese initiative targetting 2nm process technology, has signed an MoU with the UK Semiconductor Centre (UKSC) covering future semiconductor manufacturing. In January 2026, the leaders ...
The TimePictra 12 platform supports a range of Microchip’s synchronisation products. These include the TimeProvider 4100, ...
IQE and Tower Semiconductor have signed a multi-year agreement for the supply of Indium Phosphide (InP) epiwafers for optical connectivity applications serving AI-driven data centre infrastructure.
Airbus, Rohde & Schwarz, constellr, Orbint, and HPS are collaborating together to form what they call a sovereign space ...
Midas Displays is shipping its Aurum series of TFT displays. The range combines high brightness screens, a unified flex ...
Q1 smartphone production fell 1.7% to 284 million units, reports TrendForce. Despite a sharp rise in memory prices since the second half of 2025, the effect on production was minimal because brands ...
Nexperia and Semikron Danfoss have signed an MoU to explore a strategic collaboration on SiC-based power modules for automotive traction inverter applications. The collaboration aims to combine ...
SAIL is intended to work alongside the Sunrise fusion AI system developed by the University of Cambridge and UKAEA. Built on ...
The memory market has always suffered highs and lows, as capex expansion, investment and demand fuelled voltatility and ...
Yesterday Tesla’s FSD (Full Self-Driving) supervised driver assistance software was authorised in Belgium – the fifth ...
Qualinx has completed a fully European-based, end-to-end semiconductor manufacturing flow at GlobalFoundries’ Dresden fab on its FD-SOI technology. It shows that security-critical chips for aerospace, ...
K3Metrology is a spin-out from the National Physical Laboratory (NPL) developing large-scale measurement technology for ...
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