AMD has launched a four-part senior unsecured debt offering expected to raise between $4 billion and $5 billion. The transaction arrives as semiconductor companies commit substantial capital to AI ...

Thermaltake has introduced the CAPO X, a showcase enclosure capable of housing two independent PC systems. The primary chamber accepts a Micro-ATX motherboard, while a second position supports a ...

Sandisk has outlined unusually ambitious financial targets for fiscal 2028 through 2030, forecasting mid-to-high-teen annual revenue growth and non-GAAP gross margins of approximately 80%. The company ...

An owner of an early PlayStation 5 has reported severe overheating accompanied by visible changes in the console’s liquid-metal thermal interface. After opening the system, the owner reportedly found ...

Retail tracking based on Newegg listings indicates substantial August price increases across much of NVIDIA’s GeForce RTX 50 lineup. The RTX 5060 rose from an average of approximately $370 in July to ...

AMD has disclosed two high-severity Trusted Platform Module vulnerabilities affecting a broad range of Ryzen, Threadripper, EPYC and embedded processors. CVE-2026-6726 is an out-of-bounds-read ...

Intel CEO Lip-Bu Tan says the company is reevaluating memory technology as a central part of future processor architecture rather than treating DRAM as a largely interchangeable external component.

Kioxia and Sandisk have announced a 2-terabit QLC NAND component based on their ninth-generation three-dimensional flash platform. The device stores four bits per cell and uses a six-plane ...

Beelink ME Pro Combines Ryzen AI 9 HX 470 With Four-Bay Storage and 10GbE Beelink has updated its ME Pro compact storage system with AMD’s Ryzen AI 9 HX 470 processor. The two-bay version costs CNY ...

TSMC says its production 5.5-reticle-size CoWoS packaging technology can achieve yields approaching 99% on selected products. The 2.5D packaging platform has reportedly maintained yields above 98% ...

DapuStor has demonstrated a 512TB-class enterprise SSD using the emerging EDSFF E2 form factor. The drive is based on the company’s R6060 platform, combining an in-house DP800 PCIe 5.

NVIDIA is reportedly testing reduced-memory Rubin Ultra accelerators containing 192GB or 256GB of HBM4. The proposed configurations would make the accelerator easier to manufacture while advanced HBM ...