Photonics is forcing EDA to verify not just chips, but the physics of light inside full electro-optical systems.

AI-driven compute demands have led to several distinct supply chain bottlenecks for data centers. Legacy power management ...

Scaling NoCs across chiplets requires earlier validation of coherency, congestion, thermal effects, and fault behavior.

As systems become more advanced, engineering intelligence cannot remain fragmented across isolated AI models that only ...

Self-Heating and Radiation Hardness Studies of 3nm GAA-FET-Based SRAM with Different Substrate Isolation Techniques San Jose State University, Sandia National Laboratories ...

Researchers from Chalmers University of Technology and Stanford University fabricated transistors from three different atomically thin 2D semiconductors with channel widths as small as 25nm. “These ...

Change is coming, but how quickly depends on the availability of data and when chipmakers are confident enough to let AI take over.

You probably know this bottleneck too well: full transistor-level or physical simulations—whether analog circuit, electromagnetic, or thermal—can take weeks or even months. For complex designs, ...

A circuit can look perfect on day one and still drift out of specification after months or years of electrical and thermal stress. That is the reliability problem in a nutshell: the design does not ...

Securing physical AI; agents need feedback; 3D-IC security; chiplet interoperability; RF digital twins.