HBM is a reliability bottleneck, requiring greater visibility into individual bonds and TSVs, and more sophisticated SI/PI ...

Heterogeneous integration does not simply increase complexity but redistributes where quality must be assured.

A smaller set of fiber connectors that meet manufacturing test high insertion count will ease the cost burden for all. Test specifications and associated standardized test formats will facilitate data ...

Both approaches scale toward packages as large as 240 mm x 240 mm, with a roadmap extending beyond 12x reticle integration ...

An imec researcher published a technical paper titled “Bond Front Velocity in Lubrication-Mediated Bonding of Flexible ...

The energy and buzz at this year’s Design Automation Conference surprised everyone — despite initial concerns about its location in Long Beach, California, which is well off the beaten path for ...

Compute clusters offer more processing capacity but at the cost of higher power. Software is needed to allocate resources ...

As packages get larger and thinner, warpage is becoming a process-control problem rather than a simple flatness spec.

Semiconductor leaders say hardware trust, verification, and lifecycle resilience must become core design requirements rather than late-stage additions.

AI integration is accelerating aging in automotive sensors and other components. AI-powered systems must be built through meticulous, advanced model testing, but they also must adapt to future AI ...

How to build a CRA compliance strategy that connects regulatory obligations with secure engineering practices, lifecycle ...