This is where small outline compression attached memory modules (SOCAMMs) fit in. Frank Ferro, group director for product management at Cadence, talks about the benefits of this next-gen modular ...

At the end of the day, because of the techniques we utilized, we can apply these post-quantum cryptography primitives while ...

It’s generally assumed advanced materials will behave the same in the lab as in production, but that assumption is now under ...

TSMC announced three new advanced process technologies at its North America Technology Symposium last week A13, A12 and N2U ...

Through-silicon vias (TSVs) provide essential interconnects between DRAM dies inside high-bandwidth memory stacks, silicon ...

AI workloads are driving their adoption in data centers. On the other hand, photonic interconnects require a variety of ...

Large systems companies are pressing EDA vendors for performance improvements to keep pace with their AI workflows. The ...

Engineering considerations in multi-chiplet designs.

A new technical paper, “Emulation-based System-on-Chip Security Verification: Challenges and Opportunities,” was published by ...

Advances in GPU computing and multi-beam mask writing are removing constraints to enable entirely curvilinear masks.

Fine-tuning TCAD parameters with real-world feedback from test wafers is essential for quantitatively accurate and predictive results.