In edge AI, the most dangerous failure may not be a system that stops working, but one that continues operating while quietly ...

Sparks and fires caused by higher electrical currents can cause costly outages and put people in danger. Hot chips also cause ...

Enable robust cryptographic mechanisms that remain resilient even against quantum-based computational attacks.

Engineering methodologies are evolving toward more integrated and intelligent approaches across three interconnected domains: ...

Another challenge is that physical AI depends on sensors that directly connect software to the world. Cameras, lidar, radar, microphones, and positioning systems all shape how the model perceives its ...

Researchers at the University of Oxford published a technical paper titled “Hardware-Managed Heterogeneous High-Bandwidth ...

Thermal drift, stress, electromagnetic coupling, and verification gaps are turning optical integration into a full-system co-design problem rather than a plug-in bandwidth upgrade.

Researchers from University of Alberta published a technical paper titled “PPAPlace: Differentiable Cross-Stage Objectives ...

Pioneering work in developing CFET-critical modules: an improved backside contact module and a novel gate stack for threshold ...

To increase interconnect density to support the bandwidth requirements of AI workloads, manufacturers are turning to 2.5D and 3D packaging architectures. While 2.5D interposers, as passive components, ...

AI is supposed to be the answer to this. But for many teams, the AI conversation stalls before it starts, because it gets ...

Multi-die design is becoming indispensable for automotive applications, such as ADAS and IVI, addressing demands for ...