Power, token cost, interconnects, and software orchestration are pushing data centers toward heterogeneous clusters built ...

Memory tagging; digital twin of the Moon; packaging moves front-and-center; streaming sensor data.

The next power bottleneck is no longer just inside the accelerator — it is the full conversion path from medium-voltage AC to ...

Hardware and software development have traditionally been disconnected, creating little opportunity to optimize system-level performance and energy consumption. Development swings between specialized ...

HBM is a reliability bottleneck, requiring greater visibility into individual bonds and TSVs, and more sophisticated SI/PI ...

OpenAI is developing its own AI accelerator using Broadcom. Anthropic is also rumored to be exploring doing its own chip. As the developers of the most popular frontier models, one can expect they’ll ...

As AI moves from answering prompts to completing work, infrastructure has to optimize the full workflow around the model.

A smaller set of fiber connectors that meet manufacturing test high insertion count will ease the cost burden for all. Test specifications and associated standardized test formats will facilitate data ...

Data-center network fabrics are undergoing another architectural shift as optical interconnects assume a larger role in AI-cluster connectivity, extending into scale-up domains and influencing overall ...

The push toward 1-megawatt racks is forcing fundamental changes in data center architecture, including cooling, power delivery, rack design, and 3D-IC packaging. Higher rack densities may not be the ...