A cluster comprises a group of interconnected servers (aka nodes) across multiple racks, connected via Ethernet and increasingly via optical links, and is ideal for workloads that are so large and ...

Warpage is shifting from a global bow specification to a process-dependent surface-shape problem that affects bonding, alignment, lithography, reliability, and downstream assembly. Panel-level ...

Photonics is forcing EDA to verify not just chips, but the physics of light inside full electro-optical systems.

The industry needs a common, implementation-level language for functional safety data—one that enables safety information to move through the development ecosystem with the same level of consistency ...

The use of AI agents in chip design has been limited to small portions of the design flow. Engineers have been proceeding cautiously to understand how agents work, how to ensure they are delivering ...

Change is coming, but how quickly depends on the availability of data and when chipmakers are confident enough to let AI take over.

Technical Paper Research Organizations; Hardware Mechanisms to Dynamically Throttle AI Performance: Princeton University: Optimization of 3D-DRAM Architecture with Oxide-Semicondu ...

This research is significant in that it proposes a new design principle that allows the flow of light within photonic ...

Scaling NoCs across chiplets requires earlier validation of coherency, congestion, thermal effects, and fault behavior.

AI-driven compute demands have led to several distinct supply chain bottlenecks for data centers. Legacy power management ...