As AI, high-performance computing, cloud workloads, and data-intensive enterprise applications continue to scale, server memory systems are under growing pressure to deliver more bandwidth, higher ...

Heterogeneous integration does not simply increase complexity but redistributes where quality must be assured.

HBM is a reliability bottleneck, requiring greater visibility into individual bonds and TSVs, and more sophisticated SI/PI ...

OpenAI is developing its own AI accelerator using Broadcom. Anthropic is also rumored to be exploring doing its own chip. As the developers of the most popular frontier models, one can expect they’ll ...

A smaller set of fiber connectors that meet manufacturing test high insertion count will ease the cost burden for all. Test specifications and associated standardized test formats will facilitate data ...

Researchers from the University of Hong Kong, Fudan University, and National University of Singapore designed an analog content-addressable memory (CAM) utilizing 2D molybdenum disulfide (MoS 2) flash ...

The energy and buzz at this year’s Design Automation Conference surprised everyone — despite initial concerns about its location in Long Beach, California, which is well off the beaten path for ...

An imec researcher published a technical paper titled “Bond Front Velocity in Lubrication-Mediated Bonding of Flexible ...

Both approaches scale toward packages as large as 240 mm x 240 mm, with a roadmap extending beyond 12x reticle integration ...

As packages get larger and thinner, warpage is becoming a process-control problem rather than a simple flatness spec.

Compute clusters offer more processing capacity but at the cost of higher power. Software is needed to allocate resources ...

Semiconductor leaders say hardware trust, verification, and lifecycle resilience must become core design requirements rather than late-stage additions.