Every time a transistor switches, it generates heat. Pack enough transistors together and you hit a wall: the chip melts ...

Five interconnected areas critical to strengthening U.S. leadership.

The laser module is one of the least reliable components in such a system. For that reason, it remains in a convenient ...

However, sTIMs cannot be used alone, they require backside metallization (BSM) on the module to establish a thermal path and adhesion between the lid, sTIM, and the module. Conventional BSM processing ...

2026 will be a transformative year in this area — one where force fields redefine the boundaries of atomistic simulation, making previously unthinkable modeling and discoveries routine. With workflows ...

The significant increase in computing requirements for computational lithography and how GPUs can meet this demand while facilitating faster deployment times.

Because permeation and plasma-induced degradation are continuous rather than episodic, their effects accumulate gradually. There may be no excursion event, no sudden leak, and no particle spike to ...

The variety of compositions available gives designers many options to achieve the specific properties they need. Indium tin oxide (ITO), In 2 O 3, indium gallium oxide (IGO), indium gallium zinc oxide ...

Wi-Fi 7 has been a staple in high-end applications such as notebook computers and AR/VR glasses for the past couple years, where high-speed connectivity and low latency are essential. Known ...

Automatic Discovery of User-exploitable Architectural Security Vulnerabilities in Closed-Source RISC-V CPUs” was published by ...

A new technical paper titled “A nanolaser with extreme dielectric confinement” was published by researchers at Technical ...

To fill the talent gap, CS majors could be taught to design hardware, and the EE curriculum could be adapted or even shortened.