Temperature adds another challenge. Standard DFT is essentially a zero-temperature approach, so thermal effects must be ...

For the data center, chiplet economics matter, but they’re not a primary decision-driver. With the exception of processor families, chiplets cannot address consumer markets today, where economics ...

Mask inspection and repair remain the critical bottleneck, even as multi-beam writers have reduced mask-writing constraints. Curvilinear masks are becoming viable for critical layers, but ...

Sustaining AI progress requires energy-efficient computing with holistic co-design and co-optimization across the entire ...

As chips become more complex and packaging options multiply, designers have more choices than ever for connecting system ...

Multi-die assemblies are facing full system-level challenges, but engineering teams need coordinated and repeatable ways to ...

Multi-die assemblies greatly increase the number of things that can go wrong, and the difficulty of finding them.

Last month we discussed how all interconnects will be optical in the data center in five years, but that’s only part of the ...

A vision-language-action model is an end-to-end neural network that takes sensor inputs—camera images, joint positions, ...

A new HBF 3D flash stack is similar to HBM for use in AI processing. HBF capacity will be much higher, allowing static ...

A new technical paper, “TLX: Hardware-Native, Evolvable MIMW GPU Compiler for Large-scale Production Environments,” was published by researchers at UC San Diego and Meta. “Modern GPUs increasingly ...