Workflows and the addition of new capabilities are happening much faster than with previous technologies, and new grads may ...
Verifying an extensible processor is more than a one-step process, especially when software compatibility is important.
Impact Of The Film Transfer And Grain Size On The Cu-barrier Properties Of 2D WS2 Films (NUS et al.)
A new technical paper titled “Enhancing Cu-barrier properties of 2D-WS2 barriers: The role of grain size and surface passivation” was published by researchers at National University of Singapore, ...
A cornerstone of effective STCO is the ability to conduct multi-domain analyses—for example, signal integrity, power ...
Understanding connectivity issues and interactions are only part of the problem; ECOs can cause unexpected problems in other ...
Synopsys’ Secure Storage Solution for OTP IP introduces a multi-layer security architecture that pairs antifuse OTP ...
A new technical paper titled “Towards Safe Autonomous Driving: A Real-Time Motion Planning Algorithm on Embedded Hardware” was published by researchers at TU Munich. Abstract “Ensuring the functional ...
A new technical paper titled “Pushing the Envelope of LLM Inference on AI-PC and Intel GPUs” was published by researcher at ...
Wafer breakage is the most serious impact of killer crystalline defects. About 0.1 to 0.2% of silicon wafers break. The higher the number of wafer breakages, the slower the time to market. Given the ...
Programmatic control, AI integration, and automated workflows for high-frequency design.
Hardware-based security; 3D-IC challenges, opportunities; resource-constrained graphics; silicon photonics; edge AI speech ...
2026 will continue to shine a spotlight on AI as it reshapes the EDA industry. Those companies that integrate AI into workflows, develop internal talent, and maintain the security posture required for ...
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