Switchable analog, digital organic transistor; thread-based ICs; temporary e-tattoo electrodes.

Today’s most advanced AI systems rely on larger, more complex assemblies of dies and chiplets from multiple process nodes and ...

Researchers from Technische Universität Dresden and University of Manchester published a technical paper titled “The SpiNNaker2 Chip: A Many-Core Platform for Flexible and Scalable Brain-Inspired ...

The energy and buzz at this year’s Design Automation Conference surprised everyone — despite initial concerns about its location in Long Beach, California, which is well off the beaten path for ...

Photonics is forcing EDA to verify not just chips, but the physics of light inside full electro-optical systems.

Warpage is shifting from a global bow specification to a process-dependent surface-shape problem that affects bonding, alignment, lithography, reliability, and downstream assembly. Panel-level ...

A cluster comprises a group of interconnected servers (aka nodes) across multiple racks, connected via Ethernet and increasingly via optical links, and is ideal for workloads that are so large and ...

Scaling NoCs across chiplets requires earlier validation of coherency, congestion, thermal effects, and fault behavior.

Technical Paper Research Organizations; Hardware Mechanisms to Dynamically Throttle AI Performance: Princeton University: Optimization of 3D-DRAM Architecture with Oxide-Semicondu ...

Fine-pitch hybrid bonding extends a proven production technology into a manufacturing regime with much smaller margins for particles, surface variation, distortion ...

The industry needs a common, implementation-level language for functional safety data—one that enables safety information to move through the development ecosystem with the same level of consistency ...