Researchers from MIT, SLAC, Stanford University, and Argonne National Laboratory published a technical paper titled “Spatiotemporal mapping of anisotropic thermal transport in GaN thin films via ...

Both approaches scale toward packages as large as 240 mm x 240 mm, with a roadmap extending beyond 12x reticle integration ...

Semiconductor leaders say hardware trust, verification, and lifecycle resilience must become core design requirements rather than late-stage additions.

Compute clusters offer more processing capacity but at the cost of higher power. Software is needed to allocate resources ...

As packages get larger and thinner, warpage is becoming a process-control problem rather than a simple flatness spec.

A cluster comprises a group of interconnected servers (aka nodes) across multiple racks, connected via Ethernet and increasingly via optical links, and is ideal for workloads that are so large and ...

How to build a CRA compliance strategy that connects regulatory obligations with secure engineering practices, lifecycle ...

Many security architectures rely on immutable ROM as the first trusted code executed by a processor. It provides a stable foundation for authenticating the rest of the boot chain, but that same ...

Switchable analog, digital organic transistor; thread-based ICs; temporary e-tattoo electrodes.

Researchers from Technische Universität Dresden and University of Manchester published a technical paper titled “The SpiNNaker2 Chip: A Many-Core Platform for Flexible and Scalable Brain-Inspired ...

This dual challenge — cybersecurity and functional safety—is captured in two landmark standards: ISO 26262 for functional ...

Technical Paper Research Organizations; Hardware Mechanisms to Dynamically Throttle AI Performance: Princeton University: Optimization of 3D-DRAM Architecture with Oxide-Semicondu ...