A researcher from the Okinawa Institute of Science and Technology (OIST) proposes redesigning the illumination systems and projectors used in high-NA EUV lithography to reduce optical effects and ...
Mask costs are not stopping leading-edge scaling, but they increasingly influence design, node, and process choices. High-NA EUV will tighten requirements for CD, EPE, local CDU, mask 3D modeling, ...
Standalone GPUs are being replaced by heterogeneous SoCs and chiplets that combine CPUs, GPUs, and NPUs to eliminate memory ...
Ayar Labs and Wiwynn A CPO link is in one direction from the driving laser through the optical engine (OE) on the XPU, ...
On-die monitors, localized analytics, and lifecycle data are giving architects new ways to close the gap between design ...
PCIe remains a critical technology for non-AI processing. For AI, PCIe will be strengthened by scale-out, agentic AI, and ...
Researchers from University of Wisconsin-Madison and AMD Research and Advanced Development published a technical paper titled ...
Researchers from Google and University of California, Berkeley published a technical paper titled “Google’s Training ...
Yu Ma. As AI-driven workloads continue to push the boundaries of compute scale, power efficiency, and bandwidth density, ...
A new architecture enables higher data rates and densities while remaining pin-compatible with traditional DIMM.
How agents can be used to divide and conquer IC design problems.
NVMe on-controller memory; SSN datapaths; Git-based chip workflows; low-light image enhancement; testing AI networks.
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