A circuit can look perfect on day one and still drift out of specification after months or years of electrical and thermal stress. That is the reliability problem in a nutshell: the design does not ...

You probably know this bottleneck too well: full transistor-level or physical simulations—whether analog circuit, electromagnetic, or thermal—can take weeks or even months. For complex designs, ...

Joo-Ann Beh is a solution manager at Keysight Technologies, focusing on health care solutions within the General Electronics Measurement Solutions group. She began her ...

Photonics is forcing EDA to verify not just chips, but the physics of light inside full electro-optical systems.

Scaling NoCs across chiplets requires earlier validation of coherency, congestion, thermal effects, and fault behavior.

Change is coming, but how quickly depends on the availability of data and when chipmakers are confident enough to let AI take over.

Securing physical AI; agents need feedback; 3D-IC security; chiplet interoperability; RF digital twins.

AI-driven compute demands have led to several distinct supply chain bottlenecks for data centers. Legacy power management ...

Near-memory HBM for LLM inference; processing-in-memory for 3D DRAM; SDV hardware abstraction; 3nm GAAFET SRAM self-heating ...

Newer nonvolatile memory (NVM) technologies are poised to take over from flash in embedded applications on newer process ...

AI opens the door to exploring a much larger solution space, similar to what high-level synthesis did years ago, but ...

Hybrid bonding already works in production, but finer-pitch die-to-wafer integration must preserve fab-level surface and ...