Advanced node manufacturing and heterogeneous integration require partnerships that span the full value chain.

Standalone GPUs are being replaced by heterogeneous SoCs and chiplets that combine CPUs, GPUs, and NPUs to eliminate memory ...

Researchers from University of Wisconsin-Madison and AMD Research and Advanced Development published a technical paper titled ...

Researchers from Google and University of California, Berkeley published a technical paper titled “Google’s Training ...

When is a complex chip design ready to be shipped to manufacturing?

Scaling to tens of millions of CPO units per year requires the industry to first settle on automated, cost-effective methods ...

PCIe remains a critical technology for non-AI processing. For AI, PCIe will be strengthened by scale-out, agentic AI, and ...

NVMe on-controller memory; SSN datapaths; Git-based chip workflows; low-light image enhancement; testing AI networks.

Researchers from Seoul National University, Stanford University, and Chinese Academy of Sciences developed an ...

This post addresses the specific hurdle of effective and efficient manufacturing tests for these complex devices. It outlines ...

We have started to see what may be the largest disturbance in the role of a verification engineer since the founding of the ...

Yu Ma. As AI-driven workloads continue to push the boundaries of compute scale, power efficiency, and bandwidth density, ...