Intel’s expansion; Cadence AI super agent for PCB, advanced packaging; photonics fab wars; earlier Yongin fab; German funding; new CHIPS Act award; HBM standard; Quadric funding; AMS acquisition; ...
Newer nonvolatile memory (NVM) technologies are poised to take over from flash in embedded applications on newer process ...
Hybrid bonding already works in production, but finer-pitch die-to-wafer integration must preserve fab-level surface and ...
An Industry 4.0 technology roadmap for semiconductor device makers that covers carbon emissions, water, and hazardous waste.
A realistic virtual model uncovers the impact of rounded corners on sensitivity to overlay-induced resistance.
AI opens the door to exploring a much larger solution space, similar to what high-level synthesis did years ago, but ...
A model can only be used for its intended purpose, in a defined context, without taking unknown risks. Models must be created using a well-defined process and verified in a way that provides a level ...
Researchers from Georgia Institute of Technology published a technical paper titled “Open DRAM Model—Part II: Enabling ...
Investors kept pouring money into AI hardware startups in the second quarter of 2026. While companies focused on chips for AI data centers have largely dominated the funding over the past year, ...
Researchers from Rotonium, Centre for Quantum Technologies at National University of Singapore, Inveriant, Politecnico di Milano, and CNIT published a technical paper titled “Design and Benchmarking ...
Worldwide EDA, semiconductor IP, and services revenue reached $5.748 billion in Q1 2026, a 12.7% increase compared to the same period in 2025. The key driver continues to be demand for tools used to ...
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