Standalone GPUs are being replaced by heterogeneous SoCs and chiplets that combine CPUs, GPUs, and NPUs to eliminate memory ...

Advanced node manufacturing and heterogeneous integration require partnerships that span the full value chain.

Supports higher throughput, reduced cycle time, and lower cost per package, while enabling integration of increasingly ...

On-die monitors, localized analytics, and lifecycle data are giving architects new ways to close the gap between design ...

Scaling to tens of millions of CPO units per year requires the industry to first settle on automated, cost-effective methods ...

Researchers from Google and University of California, Berkeley published a technical paper titled “Google’s Training ...

Researchers from University of Wisconsin-Madison and AMD Research and Advanced Development published a technical paper titled ...

When is a complex chip design ready to be shipped to manufacturing?

Researchers from Seoul National University, Stanford University, and Chinese Academy of Sciences developed an ...

NVMe on-controller memory; SSN datapaths; Git-based chip workflows; low-light image enhancement; testing AI networks.

A new architecture enables higher data rates and densities while remaining pin-compatible with traditional DIMM.

Yu Ma. As AI-driven workloads continue to push the boundaries of compute scale, power efficiency, and bandwidth density, ...