New in-vehicle networking technology will likely take over as more AI is added, but in the near term designers face ...

The complexity problem The most direct explanation for why materials misbehave in production is also the most uncomfortable ...

If you’re working on SoCs at 2 nm or below, you know DRC is a different beast these days. Early in the design, it’s common ...

A new technical paper, “Rethinking Compute Substrates for 3D-Stacked Near-Memory LLM Decoding: Microarchitecture-Scheduling ...

Current approaches involve multiple tools, vendors, designs, data formats, and abstractions. Can agents really use them all?

TSMC announced three new advanced process technologies at its North America Technology Symposium last week A13, A12 and N2U ...

Complex chips need coherent and non-coherent sub-NoCs to ensure efficient data paths. Correct hierarchy is essential.

A new technical paper, “Highly energy-efficient manifold microchannel for cooling electronics with a coefficient of ...

A new technical paper, “Epoxy Composites Reinforced with Long Al2O3 Nanowires for Enhanced Thermal Management in Advanced ...

But the inability to utilize leading-edge process nodes has created opportunities for small and midsize chip developers in ...

Interface IP in 3D; SOCAMM in data centers; edge intelligence implementations; deposition, etch for 3D; interconnect ...

Traditional simulations lack an understanding of clocking requirements and cannot handle the complete clock network of a ...