Newer nonvolatile memory (NVM) technologies are poised to take over from flash in embedded applications on newer process ...

Hybrid bonding already works in production, but finer-pitch die-to-wafer integration must preserve fab-level surface and ...

AI opens the door to exploring a much larger solution space, similar to what high-level synthesis did years ago, but questions persist about the impact of increasing reliance on what is essentially a ...

A model can only be used for its intended purpose, in a defined context, without taking unknown risks. Models must be created using a well-defined process and verified in a way that provides a level ...

Worldwide EDA, semiconductor IP, and services revenue reached $5.748 billion in Q1 2026, a 12.7% increase compared to the same period in 2025. The key driver continues to be demand for tools used to ...

An Industry 4.0 technology roadmap for semiconductor device makers that covers carbon emissions, water, and hazardous waste.

A realistic virtual model uncovers the impact of rounded corners on sensitivity to overlay-induced resistance.

Investors kept pouring money into AI hardware startups in the second quarter of 2026. While companies focused on chips for AI data centers have largely dominated the funding over the past year, ...

Hybrid bonding is essential for the interconnect density that high-bandwidth workloads require. Successful implementation depends on control of surface chemistry and surface topography — clean ...

Researchers from Georgia Institute of Technology published a technical paper titled “Open DRAM Model—Part II: Enabling ...

Quantum computing has imprinted itself on our society as a weird, wacky way of computing that most of us can’t comprehend.