ChipAgents has introduced Renoir, an agentic large language model (LLM) whose name means “renew.” In early chip design ...
A designer’s choice of I/O connectors and interconnect protocols can be the difference between a massively profitable AI chip and a flop. I/O tradeoffs impact airflow, cooling, rack design, power ...
At the recent Data Center World 2026 in Washington, D.C., one message came through louder than ever: AI infrastructure is ...
On-die telemetry gives architects a path to replace worst-case design margin with measured silicon behavior, improving PPA without compromising resilience. As monitor density and control-loop speed ...
Researchers from University of Wisconsin-Madison and AMD Research and Advanced Development published a technical paper titled ...
In Part 1, we looked at the innovations underpinning the Cerebras WSE-3 and why its most significant breakthrough is the elimination of data movement overhead at the architectural ...
Researchers from Google and University of California, Berkeley published a technical paper titled “Google’s Training ...
Researchers from Seoul National University, Stanford University, and Chinese Academy of Sciences developed an ...
As System-on-Chip (SoC) designs become increasingly complex, engineering teams face growing challenges coordinating hardware and software development across multiple domains. Today’s projects require ...
AI scalability will require full-stack co-optimization, not just bigger data centers. AI workloads require a 10X compute efficiency gain over 10 years, making collaboration across algorithms, ...
System-level energy and bandwidth pressures are pulling optics into the package faster than the manufacturing flow can mature. Photonics combines front-end fabrication, materials, thermal, cleanliness ...
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