Current approaches involve multiple tools, vendors, designs, data formats, and abstractions. Can agents really use them all?
If you’re working on SoCs at 2 nm or below, you know DRC is a different beast these days. Early in the design, it’s common ...
The inability to access leading-edge process nodes has created opportunities for small and midsize chip developers in ...
Traditional simulations lack an understanding of clocking requirements and cannot handle the complete clock network of a ...
Analyze the effects on eye diagrams, BER, and timing margins by integrating advanced equalization algorithms into channel ...
The boundaries between IP reuse, interconnect design, and hardware-software integration are no longer independent.
Complex chips need coherent and non-coherent sub-NoCs to ensure efficient data paths. Correct hierarchy is essential.
A new technical paper, “Highly energy-efficient manifold microchannel for cooling electronics with a coefficient of ...
A new technical paper, “Rethinking Compute Substrates for 3D-Stacked Near-Memory LLM Decoding: Microarchitecture-Scheduling ...
New in-vehicle networking technology will likely take over as more AI is added, but in the near term designers face ...
Interface IP in 3D; SOCAMM in data centers; edge intelligence implementations; deposition, etch for 3D; interconnect ...
A Fault-Tolerant Compiler for Chiplet Quantum Architectures,” was published by researchers at the Technical University of ...
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