Multi-die assemblies give chip architects the option to change some dies while keeping the rest of the system intact, but which is best to keep?

Over the past decade or so, foundation models have emerged as the dominant paradigm for interacting with language, images, ...

If you’re working on standard-cell libraries at 28 nm or below, you already know the math isn’t in your favor. At the 130 nm ...

As high-NA EUV approaches, mask makers need new metrics, model-based checks, and curvilinear-native data flows to keep turn ...

Cerebras’ IPO is a meaningful moment for the semiconductor industry — and not just for the financial implications. Their confidence in their opening price reflects something the industry has ...

Precision Time Measurement; blockchain-based traceability; simulation in space; 6G PHY co-design.

Researchers from Micron Technology and Argonne National Laboratory have released “Understanding Inference Scaling for LLMs: ...

Sustaining AI progress requires energy-efficient computing with holistic co-design and co-optimization across the entire ...

Temperature adds another challenge. Standard DFT is essentially a zero-temperature approach, so thermal effects must be ...

Humanoid robots are making significant progress in performing a wide array of tasks by leveraging generative and agentic AI, and none too soon. Current projections indicate that such systems will be ...

As chips become more complex and packaging options multiply, designers have more choices than ever for connecting system ...