Researchers from Georgia Institute of Technology published a technical paper titled “Thermal Tuning Overhead in Wafer-Scale ...

Researchers from Peking University, Chinese Academy of Sciences et al. published a technical paper titled “Homo-metal-element ...

Researchers from University of Michigan-Dearborn published a technical paper titled “Generative Design of Liquid-Cooling ...

Researchers from Stanford University and SLAC National Accelerator Laboratory published a technical paper titled “Deep ...

AI is supposed to be the answer to this. But for many teams, the AI conversation stalls before it starts, because it gets ...

Can LLMs turn a specification into a set of formal properties that can be used to verify an implementation? The answer is ...

Hardware security can no longer be treated as a bolt-on feature because attacks now span chips, software stacks, networks, firmware, FPGAs, and connected systems. Regulations such as the CRA are ...

Advanced-node design to reduce iterations and improve correlation for DTCO-focused advanced AI and HPC designs.

Many digital standards, like USB4 Version 2.0 (USB4v2), LPDDR6, and PCIe 6.0, are getting more complex and time-consuming to ...

Three new, economical, and scalable platforms, triggered by the convergence of AI-related hardware needs, new process ...

Effective substrate implementation is crucial for signal integrity, power delivery, and overall system reliability.

The rapid build-out of AI on the edge marks a fundamental shift in where intelligence is located, how much is included in ...