Can LLMs turn a specification into a set of formal properties that can be used to verify an implementation? The answer is ...

AI is supposed to be the answer to this. But for many teams, the AI conversation stalls before it starts, because it gets ...

Advanced-node design to reduce iterations and improve correlation for DTCO-focused advanced AI and HPC designs.

Many digital standards, like USB4 Version 2.0 (USB4v2), LPDDR6, and PCIe 6.0, are getting more complex and time-consuming to ...

Three new, economical, and scalable platforms, triggered by the convergence of AI-related hardware needs, new process ...

Discover bugs that neither constrained-random simulation nor model-heavy equivalence flows are structurally capable of ...

Thinner dies, more TSV area, thermal dissipation, and limited manufacturing capacity make HBM scaling much more difficult.

Effective substrate implementation is crucial for signal integrity, power delivery, and overall system reliability.

I am a Swede, and I want my coffee strong and plentiful. In most places outside the Nordic countries, this means figuring out ...

Manage power density, mitigate hotspot formation, and co-optimize die and package design under increasingly constrained ...

Backside power delivery and design technology co-optimization help enable the full potential of new transistor structures.

Before deploying agentic AI into a chip design, engineers must define the domain ontology and agentic harness. Fundamental engines are still crucial.