HW methods to throttle AI; M3D DRAM; interconnect signal-integrity analysis; 3D mask effects in high/hyper-NA EUV litho; ...

Scaling NoCs across chiplets requires earlier validation of coherency, congestion, thermal effects, and fault behavior.

Change is coming, but how quickly depends on the availability of data and when chipmakers are confident enough to let AI take over.

Self-Heating and Radiation Hardness Studies of 3nm GAA-FET-Based SRAM with Different Substrate Isolation Techniques San Jose State University, Sandia National Laboratories ...

AI-driven compute demands have led to several distinct supply chain bottlenecks for data centers. Legacy power management ...

Newer nonvolatile memory (NVM) technologies are poised to take over from flash in embedded applications on newer process ...

Photonics is forcing EDA to verify not just chips, but the physics of light inside full electro-optical systems.

As systems become more advanced, engineering intelligence cannot remain fragmented across isolated AI models that only ...

AI opens the door to exploring a much larger solution space, similar to what high-level synthesis did years ago, but ...