A realistic virtual model uncovers the impact of rounded corners on sensitivity to overlay-induced resistance.

An Industry 4.0 technology roadmap for semiconductor device makers that covers carbon emissions, water, and hazardous waste.

AI opens the door to exploring a much larger solution space, similar to what high-level synthesis did years ago, but ...

Moving from large language models in the cloud to small language models at the edge is much more complicated than just slimming down the algorithms. It requires changes in both hardware and software, ...

Worldwide EDA, semiconductor IP, and services revenue reached $5.748 billion in Q1 2026, a 12.7% increase compared to the same period in 2025. The key driver continues to be demand for tools used to ...

Researchers from Georgia Institute of Technology published a technical paper titled “Open DRAM Model—Part II: Enabling ...

Investors kept pouring money into AI hardware startups in the second quarter of 2026. While companies focused on chips for AI data centers have largely dominated the funding over the past year, ...

Soaring AI/HPC device demand is driving leading-edge foundries to support the transition from wafers to panels to accommodate increasingly larger device sizes. But to ensure that panels with multiple ...

As the semiconductor ecosystem pivots to AI, it is transforming how IP is created, verified, managed, and sold.

AI infrastructure is entering a crucial new phase. The first phase of generative AI infrastructure was defined by accelerator scale: how many GPUs, NPUs or custom AI accelerators could be deployed, ...

As artificial intelligence continues its migration from centralized data centers to distributed systems, one reality is becoming unmistakable: the future of AI is increasingly defined at the edge.