The ‘Tapping Mode SQUID-on-Tip’ (TM-SOT) microscope enables multimodal imaging to be performed extremely close to the sample ...

Who will lead the integration of AI with EDA? That story has not yet been written, but there are some unlikely contenders.

Multi-die assemblies coupled with leading-edge process nodes make signoff increasingly challenging and scary. There are more corner cases and more data to consider, but no slack in the delivery ...

Researchers from Imperial College London and Bytedance released “Systems-Level Attack Surface of Edge Agent Deployments on IoT”. Abstract “Edge deployment of LLM agents on IoT hardware introduces ...

Researchers from Seoul National University and KAIST published “Oxide Semiconductor Gain Cell-Embedded Memory: Materials and Integration Strategies for Next Generation On-Chip Memory”. Abstract “The ...

Researchers from University of Bremen have released “Linear Formal Verification of Sequential Circuits using Weighted-AIGs”. Abstract “Ensuring the functional correctness of a digital system is ...

Researchers from Stanford University and University of California, Santa Cruz have released “Heterogeneous Memory Design ...

Panelists repeatedly highlighted that AI compute scaling is dramatically outpacing traditional Moore’s Law transistor ...

Nvidia’s data center revenues have skyrocketed, and hyperscaler capital expenditures soared past $70B in 2025, about double ...

Researchers from Boston University, Northeastern University, KAIST, and University of Murcia, et al. have released “FHECore: Rethinking GPU Microarchitecture for Fully Homomorphic Encryption”.

Researchers from Rice University developed a bottom-up microwave plasma chemical vapor deposition method for growing ...

The variety of compositions available gives designers many options to achieve the specific properties they need. Indium tin ...