A cluster comprises a group of interconnected servers (aka nodes) across multiple racks, connected via Ethernet and increasingly via optical links, and is ideal for workloads that are so large and ...

Warpage is shifting from a global bow specification to a process-dependent surface-shape problem that affects bonding, alignment, lithography, reliability, and downstream assembly. Panel-level ...

Change is coming, but how quickly depends on the availability of data and when chipmakers are confident enough to let AI take over.

The use of AI agents in chip design has been limited to small portions of the design flow. Engineers have been proceeding cautiously to understand how agents work, how to ensure they are delivering ...

Photonics is forcing EDA to verify not just chips, but the physics of light inside full electro-optical systems.

This research is significant in that it proposes a new design principle that allows the flow of light within photonic ...

HW methods to throttle AI; M3D DRAM; interconnect signal-integrity analysis; 3D mask effects in high/hyper-NA EUV litho; ...

Scaling NoCs across chiplets requires earlier validation of coherency, congestion, thermal effects, and fault behavior.

AI-driven compute demands have led to several distinct supply chain bottlenecks for data centers. Legacy power management ...

As semiconductor devices become increasingly central to automotive, industrial, aerospace, medical, and other safety-critical applications, functional safety has evolved from a specialized engineering ...

Intel’s expansion; Cadence AI super agent for PCB, advanced packaging; photonics fab wars; earlier Yongin fab; German funding; new CHIPS Act award; HBM standard; Quadric funding; AMS acquisition; ...