A mixture of expert agentic AI systems can focus on their tasks with or without a commanding general, but challenges remain ...

Digital twins and thermal sensors; agentic AI workflows; physical AI needs new silicon; RF design changes.

Unified Compression and Streaming Fabric (SF) provide a practical implementation methodology capable of scaling from individual IP blocks to large AI accelerators containing hundreds of millions of ...

Researchers at the University of Wisconsin–Madison and Marist University published a technical paper titled “Demystifying ...

Researchers at UCLA published a technical paper titled “Can Agents Design Better Chips with a Higher Level Abstraction?” ...

Researchers at Georgia Tech, Nvidia Research, and Stanford University published a technical paper titled “BOOST: Concurrent Access to Host Memory and HBM to Accelerate LLM Inference.” Abstract Excerpt ...

Package twins must track what manufacturing actually builds, not just design intent. Missing process and supplier data can ...

Intel may be the marquee name, but materials suppliers, packaging hubs, and quantum startups will determine whether the region becomes a true semiconductor ecosystem.

A scalable LPDDR-based memory platform optimized for edge AI inferencing.

Increasingly complex chip designs require more test data than those developed at older nodes and on single planar dies. The ...

Expanding computational capabilities and deeper co-development are changing how materials move from lab to fab.

Warpage is becoming a bigger constraint as package, interposer, and panel sizes grow. Negative thermal expansion (NTE) ...