The next power bottleneck is no longer just inside the accelerator — it is the full conversion path from medium-voltage AC to ...

Hardware and software development have traditionally been disconnected, creating little opportunity to optimize system-level performance and energy consumption. Development swings between specialized ...

The push toward 1-megawatt racks is forcing fundamental changes in data center architecture, including cooling, power delivery, rack design, and 3D-IC packaging. Higher rack densities may not be the ...

As AI moves from answering prompts to completing work, infrastructure has to optimize the full workflow around the model.

Data-center network fabrics are undergoing another architectural shift as optical interconnects assume a larger role in AI-cluster connectivity, extending into scale-up domains and influencing overall ...

Both approaches scale toward packages as large as 240 mm x 240 mm, with a roadmap extending beyond 12x reticle integration ...

HBM is a reliability bottleneck, requiring greater visibility into individual bonds and TSVs, and more sophisticated SI/PI ...

Heterogeneous integration does not simply increase complexity but redistributes where quality must be assured.

Semiconductor leaders say hardware trust, verification, and lifecycle resilience must become core design requirements rather than late-stage additions.

Researchers from Texas A&M University, KIMM, and UST published a technical paper titled “Self-Focusing Control for ...

A smaller set of fiber connectors that meet manufacturing test high insertion count will ease the cost burden for all. Test specifications and associated standardized test formats will facilitate data ...

Researchers from NVIDIA and Duke University published a technical paper titled “SCALE: Self-Supervised Constraint-Aware Layout GEneration for Local P&R DRV Fixing at Advanced Nodes.” “As semiconductor ...