Temperature adds another challenge. Standard DFT is essentially a zero-temperature approach, so thermal effects must be ...

Mask inspection and repair remain the critical bottleneck, even as multi-beam writers have reduced mask-writing constraints. Curvilinear masks are becoming viable for critical layers, but ...

Artificial intelligence (AI) is scaling at a pace that is reshaping semiconductor roadmaps, data center design, and long-term infrastructure strategy. AI promises many economic and social benefits, ...

For the data center, chiplet economics matter, but they’re not a primary decision-driver. With the exception of processor families, chiplets cannot address consumer markets today, where economics ...

As chips become more complex and packaging options multiply, designers have more choices than ever for connecting system ...

Our study is also the first time someone has shown that these kinds of optical circuits can be controlled with electrical ...

Multi-die assemblies are facing full system-level challenges, but engineering teams need coordinated and repeatable ways to ...

Multi-die assemblies greatly increase the number of things that can go wrong, and the difficulty of finding them.

A vision-language-action model is an end-to-end neural network that takes sensor inputs—camera images, joint positions, ...

Last month we discussed how all interconnects will be optical in the data center in five years, but that’s only part of the ...