Researchers from Georgia Institute of Technology published a technical paper titled “Open DRAM Model—Part II: Enabling ...

Soaring AI/HPC device demand is driving leading-edge foundries to support the transition from wafers to panels to accommodate increasingly larger device sizes. But to ensure that panels with multiple ...

Quantum computing has imprinted itself on our society as a weird, wacky way of computing that most of us can’t comprehend.

AI is becoming part of the everyday work of IP developers who build, verify, package, support, and sell reusable design blocks. It also is changing what the IP does, how it’s created, verified, and ...

Ethernet auto-negotiation; multiphysics to avoid overdesign; PCB design reuse; mobile LLM quantization; modeling BSPDNs.

As artificial intelligence continues its migration from centralized data centers to distributed systems, one reality is becoming unmistakable: the future of AI is increasingly defined at the edge.

The AI revolution is significantly outpacing the IC industry’s ability to sufficiently test multi-chip systems for all necessary failure mechanisms at probe, final test, and system-level test. The ...

As AI infrastructure fragments into specialized tiers, CPUs are becoming the orchestration layer for agentic workloads.

AI is rocketing ahead. It is the biggest industrial revolution of our age. AI adoption is growing, but still most are at ...