HW methods to throttle AI; M3D DRAM; interconnect signal-integrity analysis; 3D mask effects in high/hyper-NA EUV litho; ...

Scaling NoCs across chiplets requires earlier validation of coherency, congestion, thermal effects, and fault behavior.

AI-driven compute demands have led to several distinct supply chain bottlenecks for data centers. Legacy power management ...

Self-Heating and Radiation Hardness Studies of 3nm GAA-FET-Based SRAM with Different Substrate Isolation Techniques San Jose State University, Sandia National Laboratories ...

Tools are currently built with a defined notion of how they will be used. For agentic solutions they will be transformed into collections of callable engines. Agents may be built by EDA companies for ...

Newer nonvolatile memory (NVM) technologies are poised to take over from flash in embedded applications on newer process ...

Photonics is forcing EDA to verify not just chips, but the physics of light inside full electro-optical systems.

AI opens the door to exploring a much larger solution space, similar to what high-level synthesis did years ago, but ...

As systems become more advanced, engineering intelligence cannot remain fragmented across isolated AI models that only ...

Synopsys’ Dana Neustadter and Ilya Tolchinsky warn that physical AI creates a different kind of security challenge that requires continuous runtime assurance to ensure outputs remain within safe ...