Ligitek is accelerating its move from LED packaging into silicon photonics (SiPh) and high-speed optical communications, with ...

Microsoft has unveiled its consolidation of its operating segments from three down to two: Agents and Infra alongside Devices ...

Xiaomi and Huawei will unveil new foldable smartphones on September 7, ahead of Apple. Though Samsung Electronics is expected ...

Broadcom Senior Vice President and General Manager of the Core Switching Group Asad Khamisy said at the Semicon Taiwan 2026 ...

Chinese DRAM maker CXMT has launched its 2027 global recruitment campaign, opening roles across circuit design, R&D, ...

Chinese advanced packaging provider SJ Semiconductor (SJSemi) has expanded its silicon-interposer-based 2.5D packaging ...

Intel's US$23 billion equity raise in August was pre-funding for a capacity build driven by demand and process confidence ...

TSMC says surging AI demand is stretching the global chip industry beyond its usual planning cycle, with fast-changing ...

Solomon Technology has integrated its AI vision and optical technologies into inspection applications to prevent equipment ...

BYD Semiconductor has begun mass production of a new automotive-grade 4D millimetre-wave radar chip built around its Xuanji ...

Taiwanese compound semiconductor maker WIN Semiconductors said on September 1, 2026, that compound semiconductors are the ...

Unimicron chairman SC Chien said the company is working to ease the tightening shortage of AI substrates as MediaTek seeks ...