China is broadening its advanced packaging base as restrictions on leading-edge semiconductor equipment complicate further ...

Huawei has unveiled its next-generation Ascend 960 supernode, positioning near-packaged optics (NPO) at the centre of its ...

Wonju, a South Korean city of about 360,000, roughly 90 minutes east of Seoul, opened a government-funded institute on ...

Samsung Electronics has reportedly begun trial production of Tesla's next-generation AI5 processor at its Taylor foundry in ...

Apple is exploring a return to the enterprise server market with an AI inference system built around future M8 Ultra chips, ...

Japanese semiconductor materials leader Tokyo Ohka Kogyo (TOK) held a completion ceremony on September 15, 2026, for a new ...

SK Hynix is keeping its US memory options open as customers move earlier to secure 2027 supply, with tightening availability ...

Foxconn Industrial Internet (FII) chairman Brand Cheng said Foxconn is integrating four core capabilities — technology, ...

Taiwan has demonstrated its strong R&D and innovative capabilities in tech, but the challenge remains in propelling these ...

Dassault Systemes marked 20 years in Taiwan with a sharper message about where it plans to go next. The company said it is ...

The EU's Packaging and Packaging Waste Regulation (PPWR, Regulation (EU) 2025/40) has been in force since Aug. 12, 2026, ...

Taiwan is developing an emissions trading scheme (ETS) alongside its carbon fee system, with the Ministry of Environment ...