India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state of Odisha, marking ...

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E Ink Holdings said it will showcase multiple color e-paper technologies and complete solutions at Computex 2026, presenting products aimed at outdoor and indoor advertising, smart retail and ...

AUO's entry into Micro LED co-packaged optics sampling could give the display maker a new growth path as it seeks to expand beyond panels. Chairman Paul Peng said the company is preparing optical ...

AI demand for high-performance chips is driving up orders for semiconductor silicon capacitors, or Si-Caps, with Samsung ...

C2i Semiconductors has advanced its power management technology with the tape-out of a chip designed for AI infrastructure, ...

Amazon Web Services (AWS) won a US$6 billion AI infrastructure agreement with Snowflake, announcing expanded deployment of ...

The US reduced Section 232 tariffs on Taiwan auto parts from 27.5% to 15%, a move that Taiwan auto parts manufacturer Tong ...

The European Commission wants governments to buy chips from EU startups as Brussels seeks to reduce the bloc's reliance on US ...

Dell reported a record first quarter for fiscal 2027, with revenue rising 88% to US$43.8 billion and diluted earnings per ...

At the Nvidia AI Factory MGX Ecosystem Showcase in Taipei, CEO Jensen Huang praised supply chain partners in Taiwan, noting it will double capacity in 2026 to support Vera Rubin production ramp.

Wistron told shareholders on May 29 that it expects artificial intelligence to be in the early stages of growth and could ...