Future Electronics, a global distributor of electronic components, and SnapMagic, a provider of CAD models and design ...

TDK Corporation announces its participation in Embedded World 2026, held from March 10 to March 12 in Nuremberg, Germany. At ...

Emerson has unveiled the NI USRP X420, a software defined radio (SDR) designed to meet the demanding requirements of advanced radar systems, satellite communications and emerging 6G research. The X420 ...

Currently in pre‑release, the TASKING RH850 Compiler will be available to selected customers in April ahead of its public rollout in Q2. It supports the established RH850/U2x MCU family with full TÜV ...

Aetina Corporation, a provider of edge artificial intelligence (AI) solutions, is set to debut its award-winning AIP-FR68S AI Agent Edge Workstation at Embedded World 2026. In collaboration with ...

As data center operators push rack densities higher and accelerate the adoption of direct liquid cooling (DLC), the demands on cooling infrastructure are fundamentally changing. Unlike traditional air ...

Qualcomm Technologies and Rohde & Schwarz collaborated in 2025 to realize Channel State Information (CSI) feedback technology leveraging AI/ML for advanced mobile networks and RAN infrastructure. The ...

A mouse-shaped robot designed for inspecting the collider infrastructure at CERN has been developed by a team of engineers from the U.K. Atomic Energy Authority (UKAEA) robotics center, RACE (Remote ...

Nordic Semiconductor, a developer of low-power wireless connectivity solutions, has announced a major expansion of its ultra-low-power cellular internet of things (IoT) products and technologies ...

ROHM Co., Ltd. and Suchi Semicon Pvt. Ltd. have announced the establishment of a strategic semiconductor manufacturing ...

The research recently published in the Nature Microsystems & Nanoengineering journal demonstrates Menlo Micro’s cryogenic MEMS Ideal Switch platform in scalable quantum computin ...