BizLink has begun small-volume shipments of co-packaged optics (CPO), but chairman Roger Liang said mass deployment remains constrained by fiber array unit (FAU) assembly, thermal management and ...

Samsung Electronics is reportedly testing Micron's most advanced 1γ LPDDR5X memory for possible use in the Galaxy S27 series, ...

As AI chip package sizes continue to expand, advanced packaging is moving up the technology ladder. Glass substrate and through-glass via (TGV) technologies have become a new competitive focus for ...

Wiwynn has officially kicked off mass production at its first US manufacturing facility. Departing from its previous strategy ...

AI infrastructure customers are starting to reconsider how much high-bandwidth memory (HBM) needs to be placed alongside ...

US memory chip startup Kepler Computing has emerged from stealth after seven years, disclosing US$468 million in total funding and a plan to rethink how high-density memory is manufactured.

As artificial intelligence (AI) models move from answering questions to autonomously completing multi-step tasks, OpenAI's ...

Altera, the programmable-chip maker backed by Silver Lake and Intel, has confidentially filed for an initial public offering ...

Sharp Corporation began taking orders in Japan on September 15 for AI servers procured from its Taiwanese parent, Foxconn, ...

Taiwan's IC design sector is growing fast, but the gains are concentrated in memory. Combined January–August 2026 revenue at ...

Huawei and Seres, a Chongqing-based premium manufacturer of high-end electric NEVs, are reportedly adjusting their smart ...

Lens Technology is pushing its precision-glass expertise into two higher-value markets that could reshape its growth profile: ...