DIGITIMES

CXMT to spend US$5.2 billion on R&D and testing as DRAM supply stays tight

China's ChangXin Memory Technologies (CXMT) plans to invest CNY34.9 billion (approx. US$5.2 billion) in technology R&D and ...
DIGITIMES

South Korea AI compute squeeze hits researchers and startups

South Korea's AI sector is facing a growing GPU shortage as research institutes and small companies struggle to secure enough ...
DIGITIMES

AI boom sends China and Taiwan's PCB makers racing to HK for capital

Global investment in AI infrastructure is expanding rapidly, driving specification upgrades across the supply chain, from AI ...
DIGITIMES

Samsung Electro-Mechanics to invest US$5 billion in ABF substrate expansion

Samsung Electro-Mechanics said it will invest KRW6.78 trillion (about US$5 billion) in South Korea and Vietnam to expand ABF ...
DIGITIMES

Advanced packaging shifts toward system integration as AI renews semiconductor talent appeal

At Singapore's Innovate Together 2026 conference on September 25, executives and researchers from A*STAR's Institute of ...
DIGITIMES

Beyond 16 layers: HBM stacks test advanced packaging equipment makers

At Singapore's Innovate Together 2026 conference on September 25, equipment makers including ASM, ASMPT, and KLA said the ...
DIGITIMES

Samsung bonus plan to lift South Korea talent race

Samsung Electronics' Device Solutions division is set to announce the calculation and payout rules for its special management ...
DIGITIMES

GlobalFoundries eyes GaN expansion to challenge TSMC in AI

GlobalFoundries (GF) is preparing a major global capacity expansion as TSMC is set to gradually exit gallium nitride (GaN) ...
DIGITIMES

SK Hynix tests HBM5 with TSMC as HBM4 enters Nvidia's next platform

SK Hynix has validated its HBM5 memory with TSMC's CoWoS packaging, the company said in a September 28 post on its corporate ...
DIGITIMES

GF's MIPS bets on RISC-V physical AI, expands into autos and data centers

MIPS, a GlobalFoundries (GF) unit, said it has completed its integration with the ARC unit acquired from Synopsys earlier ...
DIGITIMES

Taiwan's Brave Eagle reaches 55% domestic content, bringing 200 suppliers into aerospace

Taiwan's Brave Eagle advanced jet trainer program officially concluded its production phase in 2026, but the capabilities ...
DIGITIMES

HBM to take nearly 30% of DRAM capacity as Samsung speeds up P5

High-bandwidth memory (HBM) is expected to account for nearly 30% of DRAM makers' total wafer capacity in 2027, up from about 20% currently, as Samsung Electronics moves to accelerate the rollout of ...