Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Ceramic needles with Luer Lok for conductive epoxies ...

This study evaluates copper redistribution layer fusing currents in wafer-level packaging through experiments and simulations, finding that silicon thickness significantly improves heat dissipation ...

Leading IC manufacturing and technology services provider increases chip-on-wafer (CoW) yield by 3.3% from 96.47% to 99.66% with Nordson Electronics Solutions ...

TrueFlat technology uses negative pressure reflow and Advanced Thermal Control (ATC) to reduce warpage, micro spikes, and CTE mismatch defects in ultra-miniaturized electronic assemblies with fragile ...

TECHCET reports that in 2024, the materials market reacted to partial recovery in semiconductors, which was strongly driven by revenues for advanced nodes, including ...

The Fraunhofer Institute for Photonic Microsystems IPMS, in collaboration with DIVE imaging systems GmbH, has achieved a major milestone in resource-efficient semiconductor ...

SEMI Southeast Asia is proud to announce the appointment of Dato' Bock KL, Senior Vice President, Global Flash Backend Operations, Sandisk, as the new Chairman of the SEMI ...

Heidelberg Instruments has made significant performance upgrades to its renowned DWL 66+ direct-write lithography system, solidifying its position as the ultimate research ...

Semiconductor Packaging News - Exclusive: New Littelfuse TVS Diodes Cut Clamping Voltage by Up to 15% for DC Line Protection ...