ST Microelectronics has unveiled an all-in-one, direct time-of-flight (ToF) 3D light detection and ranging (lidar) module ...
At APEC 2024, Power Integrations unveiled the InnoMux-2 family of single-stage, independently regulated multi-output offline ...
At Mobile World Congress 2024, Qualcomm Technologies Inc. introduced the seventh generation of its 5G modem-to-antenna solution.
Skyworks Solution Inc. and Samsung Electronic Co. Ltd. have entered a strategic partnership to integrate Skyworks’ SKY5 transceiver-to-antenna radio frequency front-end (RFFE) into the next generation ...
Taiwan Semiconductor Manufacturing Co. (TSMC) has opened its first Japanese fab, a collaboration with Sony Group, Denso Corp.
Keysight Technologies, Inc. has collaborated with NVIDIA to create a complete design flow for training and validating neural ...
Vishay Intertechnology, Inc. has introduced five new half-bridge insulated-gate bipolar transistor (IGBT) power modules in ...
Infineon will showcase its incoming portfolio of energy-efficient power management devices at APEC 2024, diving into their ...
Today, onsemi announced the availability of its 1,200 V SPM31 intelligent power modules (IPMs) featuring the latest generation Field Stop 7 (FS7) insulated gate bipolar transistor (IGBT) technology.
The main board is the brains and heart of the Google Pixel Fold smartphone with the main applications processor the Google ...
GlobalFoundries (GF) is the first semiconductor foundry to receive CHIPs and Science Act incentives with $1.5 billion of ...
Protocol test solution provider Teledyne LeCroy Inc. has announced the availability of the qdPrime test suite. This new ...