Design-Reuse2d
GOWIN's progress in global automotive market gathers momentum with award of ISO 26262 certification for its FPGA design environment
High safety and reliability ratings of the GOWIN mid- and low-density FPGAs prompt automotive OEMs to design them into ...
Design-Reuse6d
World IP Day: A Time to Reflect on the Value of Semiconductor IP
April 26th is World IP Day, celebrated annually to highlight the role that intellectual property (IP) rights play in ...
Design-Reuse6d
Altera in negotiation on private equity partner
Intel expects to see a partnership with private equity on the spin out of its Altera FPGA business later this year.
Design-Reuse4d
Open Standard Clarifies the Role of UWB vs Bluetooth
The tracker-tag technology helping you to find your keys just got a lot better, enabling new use cases. Popularized by Apple, ...
Design-Reuse3d
Rambus Expands Chipset for Advanced Data Center Memory Modules with DDR5 Server PMICs
Rambus today announced the availability of its new family of state-of-the-art DDR5 server Power Management ICs (PMICs), ...
Design-Reuse4d
Silvaco Announces Launch of Initial Public Offering
Silvaco Group, Inc. (“Silvaco”), a provider of TCAD, EDA software, and SIP solutions that enable semiconductor design and AI ...
Design-Reuse2d
Alphawave Semi announced today a refocussing of the Board of Directors after reaching the three-year milestone since the Company's IPO
Alphawave IP Group plc, a global leader in high-speed connectivity for the world’s technology infrastructure, announced today a refocussing of the Board of Directors after reaching the three-year ...
Design-Reuse5d
TSMC's A16 Process Moves Goalposts in Tech-Leadership Game
Taiwan Semiconductor Manufacturing Co. (TSMC) has changed the tech leadership game with the announcement of its latest A16 ...
Design-Reuse2d
Radiation-Tolerant PolarFire® SoC FPGAs Offer Low Power, Zero Configuration Upsets, RISC-V Architecture for Space Applications
Along with Microchip’s Mi-V ecosystem, new device family helps system designers to lower power, size and weight and speed time to market ...
Design-Reuse2d
PCI-SIG® Announces CopprLink™ Cable Specifications for PCIe® 5.0 and 6.0 Technology
The CopprLink Cable specifications provide signaling at 32.0 and 64.0 GT/s and leverage well-established industry standard connector form factors maintained by SNIA.
Design-Reuse6d
SoC NoCs: Homegrown or Commercial Off-the-Shelf?
The developers of today’s system-on-chip (SoC) devices face a myriad of decisions. Some of the early choices start when defining the overall architecture of the device. Next comes the determination of ...